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Method and system for back-drilling pcb board

A PCB board and back-drilling technology, applied in the field of PCB board back-drilling methods and systems, can solve problems such as difficult problems, PCB board thickness errors, etc.

Active Publication Date: 2016-08-10
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the primary problem affecting the accuracy of back drilling is the thickness error of the PCB board. How to effectively eliminate the influence of the thickness error of the PCB board on the accuracy of back drilling is a major problem at present.

Method used

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  • Method and system for back-drilling pcb board
  • Method and system for back-drilling pcb board
  • Method and system for back-drilling pcb board

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0035] see figure 1 , which is a method flow diagram of a PCB back-drilling method of the present invention, a conductive layer is set between the surface of the printed circuit board PCB on the side of the metallized hole PTH for back-drilling and the target signal layer of the PCB. layer, the conductive layer is connected to the PTH, and the target signal layer is a signal layer corresponding to the current back-drilling task. The method includes the following steps:

[0036]What needs to be explained here is that the PTH of the PCB board is a metallized hole on the PCB board. In general, it is at least connected to the upper and lower surface copper foils of the PCB board and the target signal layer in the PCB board. Start from one side of the PCB board, that is, drill holes from the copper foil on that side to the target signal layer. The main reason for emphasizing the target signal layer here is that there are multiple signal layers in the PCB board. For a PTH, there may...

Embodiment 2

[0069] Corresponding to the aforementioned PCB back-drilling method, an embodiment of the present invention also provides a PCB back-drilling system. see Figure 4 , which is a schematic diagram of the system structure of a PCB back-drilling system in the present invention. A conductive layer is set between the PCB surface on the side of the PTH used for back-drilling and the target signal layer of the PCB, and the conductive layer is connected to the PCB target signal layer. The PTH is connected, the target signal layer is the signal layer corresponding to the current back-drilling task, and the system includes a PCB board 41 and a back-drilling device 42 . The following will further introduce its internal structure and connection relationship in combination with the working principle of the system.

[0070] The PCB board 41 includes a PTH411, a PCB board surface 412, a target signal layer 413, and a conductive layer 414 on the side where the PTH is used for back drilling; ...

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Abstract

A back drilling method and system for a PCB. A conducting layer is arranged between the surface of a printed circuit board (PCB) at one side of a plated through hole (PTH) used for back drilling and a target signal layer of the PCB, the conducting layer is connected to the PTH, and the target signal layer is a signal layer corresponding to a current back drilling task. The back drilling method comprises: conducting first back drilling on the PTH in a first pre-set depth from the surface of the PCB at the side of the PTH used for back drilling, so that a drilling hole formed by the first back drilling drills through the conducting layer, and does not drill through the target signal layer; after the first back drilling is completed, backtracking a back drilling drill pin until the back drilling drill pin is separate from the electric connection with the conducting layer; controlling the back drilling drill pin to move from the drilling hole formed by the first back drilling to the target signal layer, and detecting whether the back drilling drill point is in contact with the conducting layer or not; and when the back drilling drill pin is in contact with the conducting layer, completing second back drilling in a second pre-set depth from the conducting layer, so that the second back drilling does not drill through the target signal layer.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method and system for back-drilling a PCB board. Background technique [0002] Printed Circuit Board (Printed Circuit Board, PCB board), also known as printed circuit board, printed circuit board, is an important part of the physical support of electronic products and signal transmission, the metallized hole (Plated throughhole, PTH) in the PCB board A section of useless copper hole that is not used for signal transmission will increase the loss of signal transmission in the PCB board, and even destroy the integrity of signal transmission. Length, so as to reduce its impact on the signal transmission of the PCB board. Making the length of the copper in the useless hole or the distance from the outermost end of the copper in the useless hole to the signal layer as short as possible, and not drilling through the signal layer is a key indicator to measure the back-drilling performan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
CPCH05K3/0047H05K3/429H05K2203/0207
Inventor 杨永星高峰黄明利
Owner HUAWEI TECH CO LTD