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Folding methods for making frames of board level electromagnetic interference (EMI) shields

A framework, electromagnetic technology, applied in the fields of magnetic/electric field shielding, electrical components, etc., can solve problems such as inability to work, deterioration of important signals, loss, etc.

Active Publication Date: 2013-12-11
LAIRD TECH (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This electromagnetic interference (EMI) can cause degradation or complete loss of important signals, making electronic equipment inefficient or non-functional

Method used

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  • Folding methods for making frames of board level electromagnetic interference (EMI) shields
  • Folding methods for making frames of board level electromagnetic interference (EMI) shields
  • Folding methods for making frames of board level electromagnetic interference (EMI) shields

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Embodiment Construction

[0037] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0038] Figure 1 to Figure 3 is a representative diagram of a conventional method of manufacturing frames for EMI shielding devices. More specifically, image 3 shows that can be formed (eg, folded, bent, etc.) to make figure 1 and figure 2 A flat material 10 of a conventional frame 12 is shown in FIG. In this conventional method, the material 10 includes profiles for a first frame portion 14 and a second frame portion 16, wherein the second frame portion 16 is completely disposed within the occupied area defined by the first frame portion 12, the inner area or outside the perimeter.

[0039] After realizing that conventional methods for making frames have relatively low material utilization, the inventors of the present invention have developed and disclosed herein new methods of making frames that increase material utilization (e.g., up to 75 % etc.) and reduces ...

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Abstract

The invention discloses methods of making frames for electromagnetic (EMI) shielding apparatus. An exemplary method generally includes steps of forming a frame, wherein the frame is provided with at least a first frame portion, a second frame portion, and a common sidewall, and the common sidewall includes at least a portion shared by and connecting the first and second frame portions. The second frame portion is repositioned from being disposed within a footprint of the first frame portion to outside the footprint of the first frame portion. Another exemplary embodiment includes a frame having first and second frame portions wherein the second frame portion is of a size sufficient to fit within an interior region defined by the first frame portion; and the first and second frame portions share at least a portion of a common sidewall having a bendable hinge portion that connects the second frame portion to the first frame portion.

Description

[0001] Cross References to Related Applications [0002] This application is a PCT International Application of US Patent Application No. 13 / 017967 filed January 31, 2011 and claims priority therefrom. The entire disclosure of the aforementioned application is incorporated herein by reference. technical field [0003] The present disclosure generally relates to electromagnetic interference (EMI) / radio frequency interference (RFI) shielding suitable for shielding components on printed circuit boards. Background technique [0004] This section provides background information related to the present disclosure which is not necessarily prior art. [0005] Electronic devices often generate electromagnetic signals in one part of the electronic device that radiate to and interfere with another part of the electronic device. This electromagnetic interference (EMI) can cause degradation or complete loss of important signals, rendering electronic equipment inefficient or non-function...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
CPCH05K9/0032Y10T29/49002
Inventor 伊戈尔·维诺库尔G·R·英格利史Z·M·科鲁斯
Owner LAIRD TECH (SHANGHAI) CO LTD