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Thin substrate electrostatic chuck system and method

An electrostatic chuck and substrate technology, applied in the direction of holding devices, circuits, electrical components, etc. that apply electrostatic attraction, can solve the problem of damaging the edge of the substrate

Active Publication Date: 2013-12-18
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The problem with this type of device is that it tends to damage the edge of the substrate

Method used

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  • Thin substrate electrostatic chuck system and method
  • Thin substrate electrostatic chuck system and method
  • Thin substrate electrostatic chuck system and method

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Embodiment Construction

[0018] In aspects of the invention, electrostatic chucks that include a power source can be provided. In one or more implementations, the power source may be an alternating current (AC) power source. In one or more embodiments, the power supply may be a high voltage power supply. Also, in a further aspect, a high voltage power supply can be used in conjunction with thin semiconductor substrates. Thin semiconductor substrates may optionally be supported on glass or other non-conductive supports. Thin semiconductor substrates can extend up to 300mm, or more. Optionally, the power supply can be modified to better support high voltage operation without arcing. Optionally, the power cables used can be modified to better support high voltage operation. In another aspect of the invention, the non-conductive carrier used to support the thin semiconductor substrate can be sputtered with a thin layer of conductive material. Further, the system can be used with conventional semicond...

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Abstract

The invention discloses a thin substrate electrostatic chuck system and method. In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate attached to an electrically insulating carrier; and an AC power supply electrically coupled to the electrostatic chuck.

Description

technical field [0001] Aspects of the invention generally relate to electrostatic chucks for securing substrates during semiconductor processing. Background technique [0002] As part of the semiconductor device production process, it is often necessary to support, for example, a semiconductor substrate that serves as a substrate for the various device layers that make up the device. Typically a device called a chuck is used. Mechanical chucks typically include some type of mechanical pins to support the substrate. A problem with this type of device is that it tends to damage the edges of the substrate. This problem is magnified when thin substrates are used in the process. Therefore, it is desirable to improve the ability to support thin substrates during the growth process. This is especially important for larger substrates, up to, for example, 300mm. Contents of the invention [0003] A processing system according to various embodiments may include: an electrostati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/6833H02N13/00H01L21/6831Y10T29/49117H01L21/26513H01L21/67103H01L21/67253H01L21/68764
Inventor 埃瓦尔德·威尔茨奇彼得·朱潘
Owner INFINEON TECH AG
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