Unlock instant, AI-driven research and patent intelligence for your innovation.

Cross interconnection structure among boards and memory with cross interconnection structure

A cross-connection and board-to-board technology, applied in the computer field, can solve the problems of low memory storage density, unreasonable memory structure, and low signal quality, and achieve the effects of direct communication connection, improved signal quality, and strong compatibility.

Inactive Publication Date: 2013-12-25
JABIL CIRCUIT SHANGHAI
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Due to the irrationality of the above-mentioned memory structure, it is easy to cause various problems such as low storage density, poor heat dissipation performance, or low signal quality of the memory.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cross interconnection structure among boards and memory with cross interconnection structure
  • Cross interconnection structure among boards and memory with cross interconnection structure
  • Cross interconnection structure among boards and memory with cross interconnection structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0039] The inter-board cross interconnection structure of the present invention is suitable for storage, especially server storage with large storage capacity requirements. figure 1 A schematic structural diagram of a memory to which the inter-board cross interconnection structure of the present invention is applied is shown. like figure 1As shown, the memory 20 has a chassis 21 . The case 21 may be in the shape of a cuboid. An air inlet 22 and an air outlet 23 of the cabinet 21 are respectively formed on two opposite ends in the horizontal direction of the cabinet 21 , usually on opposite ends with a longer distance in the horizontal direction. In this specification, relative to the entire chassis 21 , the end where the air inlet 22 is located is regarded as the front end of the chassis 21 , and the end where the air outlet 23 is ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a cross interconnection structure among boards and a memory with the cross interconnection structure. The cross interconnection structure comprises a baseboard, an extender board and a middle board. The baseboard and the extender board are arranged at the bottom of a casing of the memory in parallel connection. At least one hard disk is vertically connected on the baseboard. Hard disk extension modules used for being connected with the hard disks are connected on the extender board. The middle board is vertically arranged between the baseboard and the extender board and connected with the extender board. A controller module connected on the middle board is in communication connection with the extender board through the middle board, and the extender board and the baseboard are in direct communication connection.

Description

technical field [0001] The invention belongs to the field of computers, and in particular relates to a board-to-board cross interconnection structure and a memory with the structure. Background technique [0002] As a high-performance computer serving computers in a network environment, the server has the function of listening to service requests from other computers on the network and providing corresponding services. Due to the high-speed computing requirements and big data processing requirements of the server, there is a relatively high requirement for the storage capacity of the memory used in the server. At present, most of the storages used have a plurality of hard disks arranged in the case, and the storage capacity of the storage is closely related to the number of hard disks arranged in the storage. [0003] For example, Chinese Patent Publication CN201035475 describes a built-in vertically mounted storage case, in which a plurality of hard disks are vertically fi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
Inventor 姜登科王欢欢
Owner JABIL CIRCUIT SHANGHAI