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Method and device for laser packaging of OLED substrates

A laser packaging and substrate technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of waste and low laser utilization efficiency

Inactive Publication Date: 2014-01-01
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The area of ​​the glass frit is relatively small compared to the area of ​​the glass substrate, so a lar

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  • Method and device for laser packaging of OLED substrates
  • Method and device for laser packaging of OLED substrates
  • Method and device for laser packaging of OLED substrates

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] combined with Figure 1~3 , OLED substrate laser encapsulation method, comprises the following steps:

[0027] S10: respectively arranging first and second OLED substrates to be packaged, and correspondingly disposing a first encapsulant and a second encapsulant in the first and second OLED substrates to be packaged.

[0028] Specifically, a plurality of OLED encapsulation units arranged as a whole are arranged on an OLED substrate, and an encapsulation material pre-sintered on a glass substrate (usually a glass encapsulation material) is arranged around each OLED encapsulation unit, and la...

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Abstract

A method for laser packaging of OLED substrates comprises the steps of respectively arranging a first to-be-packaged OLED substrate and a second to-be-packaged OLED substrate, enabling a first packaging material and a second packaging material to be correspondingly arranged in the first to-be-packaged OLED substrate and the second to-be-packaged OLED substrate; enabling the packaged surface of the first to-be-packaged OLED substrate and the packaged surface of the second to-be-packaged OLED substrate to be opposite and staggered; arranging a first mask plate on the first to-be-packaged OLED substrate and enabling a photic zone of the first mask plate to correspond to the position of the first packaging material; arranging a first reflection film on the first mask plate; enabling laser to perform laser scanning along the packaged surface of the first to-be-packaged OLED substrate, enabling the laser to sweep over the photic zone and performing laser packaging; enabling the laser to sweep over the first reflection film, utilizing the first reflection film to enable scanning laser to be reflected to the second to-be-packaged OLED substrate and matched with the position of the second packaging material of the second to-be-packaged OLED substrate, and performing laser packaging.

Description

technical field [0001] The invention relates to OLED encapsulation technology, in particular to an OLED substrate laser encapsulation method and device. Background technique [0002] The traditional OLED encapsulation technology is to use the laser encapsulation method of the mask to irradiate the mask plate with a linear beam, and use the host computer to control the lateral movement of the linear laser beam. This process only uses the transparent part of the mask plate, and also It is the part of the glass encapsulant printed on the glass substrate. The glass encapsulation material is irradiated with the transmitted laser, and the glass material is melted to bond the upper and lower substrates together to form an airtight seal. [0003] In the laser packaging process, only the part of the linear laser beam passing through the mask (glass frit part) is used. The area of ​​the glass frit is very small relative to the area of ​​the glass substrate, so a large part of the li...

Claims

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Application Information

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IPC IPC(8): H01L51/56
CPCH10K50/84
Inventor 张建华付奎葛军锋
Owner SHANGHAI UNIV