Holder for supporting a substrate, and substrate-processing apparatus using same
A substrate processing device and support plate technology, applied in optics, instruments, electrical components, etc., can solve problems such as decreased productivity, increased cost, and long time required for temperature or cooling of substrates, thereby achieving cost savings and increased productivity.
Inactive Publication Date: 2014-01-01
TERASEMICON CO LTD
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Problems solved by technology
[0007] However, in the existing substrate processing apparatus, the lower surface of the substrate directly contacts and is supported on the upper surface of the supporting plate, so, due to the latent heat of the supporting plate, it takes a long time to increase the temperature of the substrate or cool the substrate, resulting in a decrease in productivity.
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[0022] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. These embodiments enable those skilled in the art to fully implement the present invention. The various embodiments of the invention, although different, should not be construed as mutually exclusive. For example, specific shapes, features, and characteristics of one embodiment described herein may be embodied in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the position or arrangement of individual constituent elements in each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be limiting, and the scope of the present invention is definitely limited only by all claims and their equivalents. For convenience of description, the length, area, thickness and shape of the...
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Disclosed are a holder for supporting a substrate and a substrate-processing apparatus using same. The holder for supporting a substrate and the substrate-processing apparatus using same according to the present invention are configured such that a substrate is brought into contact with and supported by support pins detachably coupled to a support plate. However, the support pins have little influence on a rise in temperature or cooling of the substrate, and therefore the time required for achieving a rise in temperature or the cooling of the substrate is relatively short. Consequently, productivity in substrate-processing may be improved. Further, the substrate is spaced apart from the support plate, thus eliminating the need for separate devices for spacing the substrate apart from the support plate, resulting in reduced costs.
Description
technical field [0001] The present invention relates to a support plate for supporting a substrate and a substrate processing apparatus using the support plate, which support a substrate by providing a plurality of support pins on the substrate. Background technique [0002] Substrate processing equipment is used in the production of flat panel displays, and is roughly divided into vapor deposition (Vapor Deposition) equipment and annealing (Annealing) equipment. [0003] As a device for forming the transparent conductive layer, insulating layer, metal layer or silicon layer that constitutes the core structure of the flat panel display, the evaporation device is divided into low pressure chemical vapor deposition (LPCVD: Low Pressure Chemical Vapor Deposition) or plasma enhanced chemical vapor deposition (PECVD) : Plasma-Enhanced Chemical Vapor Deposition) and other methods of chemical vapor deposition devices and sputtering (Sputtering) and other methods of physical vapor d...
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IPC IPC(8): H01L21/683
CPCH01L21/6875H01L21/6734G02F1/13H01L21/68H01L21/683
Inventor 许官善朴珠泳赵炳镐
Owner TERASEMICON CO LTD