Stability testing method and system

A technology of stability testing and stability, applied in the direction of electrical testing/monitoring, etc., can solve problems such as failure of integrated boards, insufficient stability testing and detection, and achieve the effect of accurate judgment

Inactive Publication Date: 2016-04-27
GUANGDONG VTRON TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a stability test method and system for the problem that the above-mentioned stability test detection is insufficient, which leads to the failure of the integrated board in actual operation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stability testing method and system
  • Stability testing method and system
  • Stability testing method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] see figure 1 , figure 1 It is a schematic flow chart of the first embodiment of the stability testing method of the present invention.

[0022] The described stability testing method of the present embodiment comprises the following steps:

[0023] Step 101 , receiving a temperature instruction and a timing instruction through a temperature regulation device for adjusting the temperature of the board and a power sequence controller connected to a terminal device that loads the board, respectively.

[0024] Step 102, the temperature adjustment device adjusts the temperature of the board to a preset temperature according to the temperature instruction, and the power sequence controller adjusts the temperature of the board to the preset temperature according to the sequence instruction. The board is powered on or powered off.

[0025] Step 103 , acquiring the power-on / off data of the board in response to the power-on or power-off operation, comparing the power-on / off da...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a stability testing method and system, the method comprising: respectively receiving temperature instructions through a temperature adjustment device used to adjust the temperature of the board and a power sequence controller connected to a terminal device that loads the board and timing instructions; the temperature adjustment device adjusts the temperature of the board to a preset temperature according to the temperature instruction, and the power sequence controller adjusts the temperature to the preset temperature according to the timing instructions power-on or power-off operation of the board; obtain the power-on or power-off data of the board in response to the power-on or power-off operation, compare the power-on or power-off data with the preset value, and judge the board according to the comparison result card stability. The above stability testing method and system can quickly and accurately judge the stability of the board in a high and low temperature testing environment.

Description

technical field [0001] The invention relates to the technical field of circuit equipment testing, in particular to a stability testing method and system. Background technique [0002] At present, the stability of integrated boards is tested at high and low temperatures, mainly through the software business directly running on the product without switching on and off, and observing relevant data outside the incubator according to the high and low temperature operating conditions. [0003] However, the above method is difficult to judge whether the integrated board is under high and low temperature conditions, especially after power-off and power-on shocks, whether there is a virtual soldering in the interface of various types of boards or whether there is a virtual connection in the contact of the slot. Therefore, the generated data is difficult to accurately judge the stability of the board, and the detection is insufficient, which leads to failure of the integrated board in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G05B23/02
Inventor 庄红星
Owner GUANGDONG VTRON TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap