Semiconductor process, semiconductor structure and its packaging structure

Abstract

The invention relates to a semiconductor technology, a semiconductor structure and a package structure thereof. The semiconductor technology comprises the following steps: providing a carrier, wherein the carrier has a metal layer, and the metal layer has a plurality of substrate areas and a plurality of lateral areas; forming a first photoresist layer; forming a plurality of bearing parts; removing the first photoresist layer to expose the bearing parts, wherein each bearing part has a bearing surface, and each bearing surface has a first area and a second area; forming a second photoresist layer which exposes the first areas of the bearing surfaces; forming a plurality of joint parts, wherein the joint parts cover the first areas of the bearing surfaces so that the joint parts are enabled to be connected with the bearing parts to form snap bumps; removing the second photoresist layer to expose the snap bumps; and removing the lateral areas of the metal layer to enable a plurality of under-bump metal layers to be formed on the substrate areas.

Description

technical field [0001] The present invention relates to a semiconductor process, in particular to a semiconductor process with button-shaped bumps. Background technique [0002] The existing conventional semiconductor packaging structure has a substrate, a chip and solder, wherein the conventional semiconductor packaging structure uses solder to electrically bond the bumps of the chip to the connection pads of the substrate. However, due to the increasing volume of current electronic products, The smaller the pitch, the smaller the pitch of the bumps on the chip. In this case, the solder is likely to overflow to the adjacent bumps during reflow and cause a short circuit, which affects the authenticity rate of the product. [0003] It can be seen that the above-mentioned existing semiconductor technology obviously still has inconveniences and defects in structure and use, and needs to be further improved urgently. In order to solve the above-mentioned problems, the relevant ...

AI Technical Summary

Problems solved by technology

[0002] The existing conventional semiconductor packaging structure has a substrate, a chip and solder, wherein the conventional semiconductor packaging structure uses solder to electrically bond the bumps of the chip to the connection pads of the substrate. However, due to the increasing volume of current electronic products, The smaller the pitch, the smaller the pitch of the bumps on the chip. In this case, the solder is likely to overflow to the adjacent bumps during reflow and cause a short circuit, which affects the authenticity rate of the product.

[0003] It can be seen that the above-mentioned existing semiconductor technology obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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