Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Material conveying device for chip mounter

A technology of feeding device and placement machine, applied in the direction of electrical components, electrical components, etc., can solve the problems of material shape limitation, large space occupation area, long strip materials cannot be conveyed, etc., to achieve the effect of reasonable design and space saving

Inactive Publication Date: 2014-01-22
SUZHOU SUPERLIGHT MICROELECTRONICS
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The feeding device of the placement machine is used to transport electronic components to the suction nozzle of the placement machine. The suction nozzle absorbs the components and places them on a fixed position on the PCB printing board. Put it in the feeding tray for transmission. This design has the problem that the shape of the material is limited. For example, the long strip of material cannot be transported at the turn of the disc, and the material can only be transported on one plane of the feeding tray, which occupies a large space. , and the existing placement machine feeding device can only transfer materials smaller than the width of the feeding tray

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Material conveying device for chip mounter
  • Material conveying device for chip mounter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Such as Figure 1-2 As shown, a feeding device of a placement machine includes a feeding bracket 1 and a feeding tube belt 2, and is characterized in that: the feeding bracket 1 includes a vertical rod and a cross bar, and one end of the vertical rod is fixedly connected to the ground, and the vertical rod The other end is fixedly connected with the cross bar; the feeding pipe belt 2 spirals into at least 3 layers of rings, and the feeding pipe belt 2 is provided with a plurality of grasping hands 3, and the feeding pipe belt 2 and the grasping material The corresponding surface of the hand 3 is fixedly connected with the lower surface of the cross bar.

[0015] The gripping hand 3 includes a gripper for grabbing materials, and a connecting rod connecting the gripper and the feeding pipe belt 2 .

[0016] The connecting rods support length adjustment, and the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a material conveying device for a chip mounter. The material conveying device comprises a material conveying support frame (1) and a material conveying pipe belt (2), and is characterized in that the material conveying support frame (1) comprises a vertical rod and a transverse rod, one end of the vertical rod is fixedly connected with the ground, the other end of the vertical rod is fixedly connected with the transverse rod, the material conveying pipe belt (2) is coiled into at least three layers of circular rings, a plurality of material grasping hands (3) are arranged on the material conveying pipe belt (2), and the surface, corresponding to the material grasping hands (3), of the material conveying pipe belt (2) is fixedly connected with the lower surface of the transverse rod. The material conveying device for the chip mounter provided by the invention has the advantages that the design is reasonable, and the material conveying device is suitable for the material conveyance of various materials and belongs to a multifunctional and compact material conveying device for the chip mounter.

Description

technical field [0001] The invention relates to a feeding device of a placement machine, in particular to a feeding device with a compact space, more materials can be placed in a unit space, and the shape of the materials is not limited. Background technique [0002] The feeding device of the placement machine is used to transport electronic components to the suction nozzle of the placement machine. The suction nozzle absorbs the components and places them on a fixed position on the PCB printing board. Put it in the feeding tray for transmission. This design has the problem that the shape of the material is limited. For example, the long strip of material cannot be transported at the turn of the disc, and the material can only be transported on one plane of the feeding tray, which occupies a large space. , and the existing placement machine feeding device can only transfer materials smaller than the width of the feeding tray. Contents of the invention [0003] The technic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/02
Inventor 乔金彪
Owner SUZHOU SUPERLIGHT MICROELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com