Laser processing method for wafer

Abstract

The invention provides a laser processing method for a wafer. The laser processing method includes steps of a), providing the wafer; b), adhering a film on the wafer; c), performing inward laser cutting along a cutting path of the wafer; d), removing the film; e), performing evaporation on the wafer without the film; f), adhering another film on the wafer; g), fragmenting the wafer; h), reversely adhering a third film on the wafer; i), expanding the film; j), testing the wafer. The cutting path is separated from the outer edge of the wafer by a preset distance. The laser processing method has the advantages that a position, which is separated from the outer edge of the wafer by the preset distance, is cut during laser cutting, so that portions, which are positioned among the outer edge of the wafer and the position separated from the outer edge of the wafer by the certain distance are prevented from being cut, the operational strength of the wafer is integrally guaranteed, the wafer is not easy to crack, the processing yield can be greatly increased, and the cracking rate can be reduced.

Description

technical field [0001] The invention relates to a wafer laser processing method. Background technique [0002] With the continuous increase of market demand, the LED manufacturing industry has higher and higher requirements for production capacity, yield and luminous brightness. Laser processing technology has become the primary tool in the LED manufacturing industry and the industry standard for high-brightness LED wafer processing. [0003] Laser scribing greatly reduces wafer microcracks and microcrack expansion, and greatly reduces the distance between LED monomers, which not only increases production capacity, but also increases production efficiency. The laser scribing mentioned here refers to laser cutting wafers. [0004] see figure 1 , in the traditional wafer processing technology, the wafer 10 to be cut is positioned on a laser cutting device, and the laser cutting device controls the laser to cut the wafer 10 along the cutting line 11 from the edge of the wafe...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present invention is to provide a wafer laser processing method, aiming to solve the problem of high fragmentation rate in subsequent processing due to the edge of the wafer being cut in the traditional wafer processing technology

Images