Silicon Micro Gyro Chip Probe Card

Abstract

The invention discloses a silicon micro-gyroscope chip probe card. The silicon micro-gyroscope chip probe card comprises a pedestal, a top cover, an elastic clamping mechanism and several probes; the elastic clamping mechanism is a clamping mechanism having chip positioning and elastic clamping functions, and is fixed on the middle part of the pedestal; the middle of the top cover is a hole, and the hole cooperates with the elastic clamping mechanism in position and size; the probes are contact probes which can be adjusted in three degrees of freedom comprising height, arc direction and radial direction; the probes are installed on the top cover, are arranged in a radial manner, and are concentrated nearby the electrode position of a test chip; the pedestal and the top cover are hinged; and the pedestal is provided with a plurality of spacing pillars, and the top cover has a plurality of spacing holes cooperating with the spacing pillars. After the primary probe position adjustment of the test chip is carried out by using the silicon micro-gyroscope chip probe card, the structure of the card allows the positioning of the probes to be accurate, so the multi-time repeated test of like chips can be realized without a microscope, thereby the batch production detection efficiency is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of aviation inertial navigation and relates to a silicon micro-gyroscope chip probe card. Background technique [0002] According to the development needs of the silicon micro-gyroscope project, its chip-level detection and screening can provide raw data for the improvement and optimization of structural design and process production, and can also provide qualified header chips for circuit joint testing. The connection of multiple tiny electrodes on the silicon microgyroscope chip and the collection of weak signals are the basic requirements of chip-level testing. Considering the workload and consistency required for batch production, the testing and screening of chip-level silicon microgyro put forward higher requirements. At present, we use a probe station to realize the connection of chip electrodes, but its limited number of probes cannot meet the signal acquisition and shielding connection of more than...

AI Technical Summary

Problems solved by technology

At present, we use a probe station to realize the connection of chip electrodes, but its limited number of probes cannot meet the signal acquisition and shielding connection of more than ten electrodes on the silicon microgyroscope chip, which affects the test accuracy of weak signals; and each electrode Accurate contact with the probe needs to be done under the microscope, which makes batch detection extremely inefficient

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