Packaging structure and packaging method based on flip-chip image sensor chip

Abstract

The invention provides a packaging structure based on inverted imaging sensor chips. The packaging structure comprises a substrate, a pass-through window is formed in the substrate, and wiring structures are arranged on the front face and the back face of the substrate and electrically connected mutually; the inverted image sensor chips are attached to the back face of the substrate in a flip chip bonding mode, and the sensing faces of the image sensor chips face toward the pass-through window; the image sensor chips are electrically connected with the wiring structures of the faces where the image sensor chips are located; glass is fixed to the front face of the substrate and covers the pass-through window completely, heat sinks are glued to the back faces of the image sensor chips through heat dissipation glue, passive devices and image sensor driving chips are attached to the portion outside the pass-through window of the front face of the substrate and electrically connected with the wiring structures of the front face, and BGA welded balls are embedded into the area, where the wiring structures are located, of the back face of the glass substrate and electrically connected with the wiring structures. The improvement of assembly accuracy is facilitated, and the packaging structure has better vibration resistance and reliability and is also good in heat dissipation performance.

Description

technical field [0001] The invention relates to a packaging technology, in particular to a packaging structure and packaging method based on a flip-chip image sensor chip. Background technique [0002] At present, the traditional CIS (image sensor) packaging is usually packaged by wire bonding. There are some problems, such as the poor heat dissipation performance of the formed CIS packaging structure, which affects the imaging performance of the CIS chip. In addition, the traditional CIS packaging process The process faced in the process is relatively cumbersome. Moreover, due to the thickness control of the adhesive behind the CIS chip and the deviation when mounting the glass sheet used to protect the CIS chip when the wire bonding method is used for packaging, the sensing area of ​​the CIS chip is on the glass surface during the CIS chip assembly process. The parallelism precision between them is not good. Moreover, the wire bonding in the wire bonding method affects t...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a packaging structure based on flip-chip image sensor chips and a corresponding packaging method, effectively solve the problem of heat dissipation and poor precision in the assembly process of CIS chips, and Compared with the wire bonding method, it has better vibration resistance and can improve the reliability of the package structure

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