Circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, which can be used in multilayer circuit manufacturing, printed circuit components, etc., can solve problems such as inflow of medicinal water, damage to conductive lines at the bottom of grooves, poor bonding, etc., and achieve the effect of preventing corrosion.
Active Publication Date: 2016-12-21
AVARY HLDG (SHENZHEN) CO LTD +1
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AI Technical Summary
Problems solved by technology
During the pressing process, it is easy to cause poor bonding between the groove bottom of the groove part and the pressed conductive layer
In this way, during the circuit making process, it is easy to cause the liquid medicine to flow into the conductive circuit at the bottom of the groove due to the damage of the outer conductive layer, thereby causing the conductive circuit at the bottom of the groove to be damaged
Method used
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Embodiment Construction
[0070] The circuit board manufacturing method provided by the technical solution includes the following steps:
[0071] For the first step, please also refer to Figure 1 to Figure 3 , providing an inner layer circuit substrate 110 .
[0072] The inner circuit substrate 110 includes a base 113 , a first conductive circuit layer 111 and a second conductive circuit layer 112 . The first conductive circuit layer 111 and the second conductive circuit layer 112 are respectively formed on two opposite surfaces of the substrate 113 .
[0073] The first conductive circuit layer 111 includes a plurality of first conductive circuits 1111 and a plurality of first connection pads 1112 . The middle area of the first conductive circuit layer 111 is defined as a first exposed area 1113 for making the bottom of the groove of the circuit board having a groove structure. Outside the first exposed area 1113 is the first pressing area 1114 . The first pressing area 1114 surrounds and connec...
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A circuit board, comprising a press-bonded substrate and an inner circuit substrate, the inner circuit substrate includes an insulating layer and a conductive circuit layer bonded on the surface of the insulating layer, the conductive circuit layer has an exposed area and a press-bonded area, the surface of the exposed area is provided with a solder resist layer, and a plurality of connection pads in the exposed area are exposed from the solder resist layer, and the laminated substrate includes a bonded film with an opening, a laminated film and a conductive The graphic layer, the adhesive film is formed on the pressing area of the inner circuit substrate, the adhesive film is in contact with the pressing film, and a groove penetrating through the pressing substrate is formed in the multilayer circuit board, and the groove is in contact with the pressing film. Corresponding to the exposed area, the solder resist layer and the connection pads exposed from the solder resist layer are exposed in the groove, and the groove is used for accommodating electronic components. The invention also provides a manufacturing method of the circuit board.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board with a groove structure and a production method thereof. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, Highdensity multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Due to the need for miniaturization of electronic equipment, a groove structure is usually provided in the circuit board, and the packaging groove is used to cooperate with other packaged or plugged electronic components, thereby reducing the space occupied by the entire circuit board package. However, in the prior art, in the process of making the above-mentioned grooves, ...
Claims
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IPC IPC(8): H05K3/46H05K1/02
Inventor 李清春沈晓君郑兆孟许哲玮李星星
Owner AVARY HLDG (SHENZHEN) CO LTD