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Semiconductor device, temperature control method thereof, and test system

A temperature control method and temperature control technology, which are applied in the direction of using electric means for temperature control to achieve the effect of reducing the number of

Active Publication Date: 2015-10-14
WINBOND ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the object of the present invention is to propose a semiconductor device and its temperature control method and testing system, so as to solve the problems mentioned in the prior art

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  • Semiconductor device, temperature control method thereof, and test system
  • Semiconductor device, temperature control method thereof, and test system
  • Semiconductor device, temperature control method thereof, and test system

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Embodiment Construction

[0033] Reference will now be made in detail to embodiments of the invention, which are illustrated in the accompanying drawings. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In addition, elements / members using the same reference numerals in the drawings and embodiments represent the same or similar parts.

[0034] figure 1 is a schematic diagram of a test system according to an embodiment of the present invention. figure 2 is a schematic diagram of the test temperature according to an embodiment of the present invention. image 3 is a test flow chart according to an embodiment of the present invention. Please refer to figure 1 , figure 2 and image 3 . The test system 100A includes a test machine 110 and a semiconductor device 120 . The semiconductor device 120 to be tested includes a temperature control unit 130 and heating units 140_1 , 140_2 . The testing machine 11...

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Abstract

The invention discloses a semiconductor device and a temperature control method thereof, and a test system. The semiconductor device comprises at least one temperature control unit and at least one heating unit. The temperature control unit is used for response to an external control signal. The temperature control unit responds to a first enabled signal of the external control signal to control the temperature of the heating unit, raising the temperature from a first work temperature to a second work temperature. According to the invention, the number of test stations and the required test space are reduced.

Description

technical field [0001] The invention relates to a semiconductor device, its temperature control method and a testing system. Background technique [0002] In the process of producing semiconductor devices, it is usually necessary to perform various functional tests at different temperatures, for example, the temperature conditions are 45°C, 85°C, 95°C, 105°C or 125°C. In the prior art, for test conditions at different temperatures, the required test temperature is often provided by adding test stations. However, this method of adding test stations requires a larger space for accommodating test machines, and greatly increases production costs, and prolongs test time when products are transported between test stations. Contents of the invention [0003] In view of this, the object of the present invention is to provide a semiconductor device and its temperature control method and testing system, so as to solve the problems mentioned in the prior art. [0004] The invention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D23/19
Inventor 张昆辉
Owner WINBOND ELECTRONICS CORP