Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Modular Fully Rugged Computer

A computer reinforcement and modularization technology, applied in the computer field, can solve problems such as unsuitable for long-term use and mass promotion and application, uneven reinforcement performance and product quality, low modularization degree, etc., to achieve reliable performance of full reinforcement, Highlight substantive features and good versatility

Active Publication Date: 2017-06-09
JINAN TENGYUE ELECTRONICS
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the different shapes and structures of functional modules such as power modules, battery modules, and core modules, the interfaces between each module and the host computer are also different for the commonly used ruggedized computers. The degree of modularization is low and the general performance is poor; , mostly a small amount of customization and selective reinforcement products, their reinforcement performance and product quality are uneven, difficult to control, not suitable for long-term use in harsh environments and mass promotion and application, very few can meet the requirements of full reinforcement and survivability Extremely strong, can meet the long-term application in the battlefield, and can quickly repair the equipment without relying on professional technicians

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Modular Fully Rugged Computer
  • Modular Fully Rugged Computer
  • Modular Fully Rugged Computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to clearly illustrate the technical features of the solution, the solution will be described below through a specific implementation mode combined with the accompanying drawings.

[0022] It can be seen from the accompanying drawings that the modularized fully reinforced computer of this program includes a main chassis, a core module 5, a power module 6, a battery module 7 and a functional module 10, and the main chassis is composed of a chassis shell 1, a main chassis communication backplane 3 and a chassis cover 2, the upper part of the chassis shell 1 is provided with a composite interface socket 8, and the chassis shell 1 is provided with a module slot 9, and the number of the module slots 9 is greater than or equal to 2, wherein as Figure 4 As shown, there are 6 module slots 9, and the shape and structure of the module slots 9 are all the same, and each module slot 9 is provided with a composite interface socket 8; the core module 5, power module 6, The s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a technical scheme of a modular fully reinforced computer, including a main chassis, a core module, a power supply module, a battery module and a functional module. The main chassis is composed of a chassis shell, a main chassis communication backplane and a chassis cover , the upper part of the chassis shell is provided with a composite interface socket, and the chassis shell is provided with module slots, the number of the module slots is greater than or equal to 2, the shape and structure of the module slots are the same, each module slot Each is provided with a composite interface socket; the shapes of each module are the same and match the shape of the module slot, or the shape of each module is the shape matched by the combination of N module slots, and N is a natural number greater than or equal to 2 Each module is provided with a composite interface plug, and the corresponding module is connected to the main chassis through the cooperation of the composite interface plug and the composite interface socket. This solution has high degree of modularization, good general performance, multi-layer comprehensive reinforcement, strong survivability, and simple repair.

Description

technical field [0001] The invention belongs to the technical field of computers, in particular to a modular fully reinforced computer. Background technique [0002] At present, information warfare has become an extremely important part of modern warfare, and various new types of equipment are inseparable from the support of information equipment. The application requirements are also increasing day by day. Due to the different shapes and structures of functional modules such as power modules, battery modules, and core modules, the interfaces between each module and the host computer are also different for the commonly used ruggedized computers. The degree of modularization is low and the general performance is poor; , mostly a small amount of customization and selective reinforcement products, their reinforcement performance and product quality are uneven, difficult to control, not suitable for long-term use in harsh environments and mass promotion and application, very fe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20
Inventor 张荣波孙健卯福生傅庆军孙菲菲冯超森王经松
Owner JINAN TENGYUE ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products