Solder paste packaging equipment

A technology of packaging equipment and solder paste, which is applied in the field of packaging equipment, can solve problems such as complex structure and low efficiency, and achieve the effect of simple equipment, high efficiency and low solution efficiency

Inactive Publication Date: 2014-03-26
KUNSHAN HONGJIA SOLDER MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing solder paste packaging equipment has complex structure and low efficiency

Method used

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  • Solder paste packaging equipment
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Embodiment Construction

[0020] The present invention provides a solder paste packaging equipment. In order to make the purpose, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0021] Please refer to figure 1 , in this embodiment, the solder paste packaging equipment includes figure 1 The feed container 3, feed cylinder 4, weighing cylinder 5, discharge cylinder 6 and packaging chamber 7 from left to right. And, they are connected with pipes so that the solder paste can be transferred between them. Wherein, the feeding container 3 is used for storing solder paste. The feeding cylinder 4 is connected to the feeding container 3, and the feeding cylinder 4 is used to control the injection of the solder paste into subsequent equipment. The weighing cylinder 5 is connected to the feeding cylinder 4, and the weighing cylinder 5 is used for monitoring ...

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Abstract

The invention provides solder paste packaging equipment which comprises a feeding container, a feeding cylinder, a quantity measuring cylinder, a discharging cylinder, a packaging chamber, and a pressure device. The feeding container is used for storing solder paste. The feeding cylinder is connected with the feeding container and is used for controlling the solder paste to be injected into subsequent equipment. The quantity measuring cylinder is connected with the feeding cylinder and is used for monitoring the solder paste and controlling the solder paste to be output in a quantitative mode. The discharging cylinder is connected with the quantity measuring cylinder. The packaging chamber is connected to the discharging cylinder and is used for packaging the solder paste into packaging bags. The pressure device is connected with the feeding cylinder, the quantity measuring cylinder and the discharging cylinder. A first feeding switch is further arranged between the feeding cylinder and the quantity measuring cylinder. A first discharging switch is arranged between the quantity measuring cylinder and the discharging cylinder. The solder paste packaging equipment can realize solder paste packaging in a quantitative mode, and is simple, high in efficiency, and capable of solving the problem of low efficiency of existing solder paste package equipment.

Description

technical field [0001] The invention relates to packaging equipment, in particular to a solder paste packaging equipment. Background technique [0002] The existing solder paste packaging equipment includes a storage tank for storing solder paste, a feed tank for controlling solder paste injection into the storage tank, and the feed tank is connected to the storage tank; a discharge tank for controlling the output of solder paste from the storage tank, The discharge cylinder is connected to the storage cylinder; the pressure equipment is connected to the storage cylinder, the feed cylinder and the discharge cylinder; the controller is connected to the detector and the pressure equipment, and is composed of several switches. The existing solder paste packaging equipment has complex structure and low efficiency. Contents of the invention [0003] Therefore, the prior art needs to be improved. The purpose of the present invention is to provide a solder paste packaging equip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B3/10B65B3/26
Inventor 易升明
Owner KUNSHAN HONGJIA SOLDER MFG
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