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High cooling capacity led lamps

A technology of LED lamps and high heat dissipation, applied in lighting and heating equipment, cooling/heating devices of lighting devices, lighting devices, etc. , the effect of rapid conduction heat dissipation

Active Publication Date: 2016-08-03
北京交通大学长三角研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the influence of the thermal conductivity of the material and the thermal conductivity area during the heat transfer process, the heat dissipation effect cannot be ideal

Method used

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  • High cooling capacity led lamps
  • High cooling capacity led lamps

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Experimental program
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Embodiment Construction

[0011] Such as figure 1 As shown, the LED lamp with high heat dissipation capability includes a circuit substrate 2 with an LED chip 1 on the front, the front of the LED chip 1 and the circuit substrate 2 are encapsulated by a hemispherical light distribution lens 3, and a drive module 4 is installed on the back of the circuit substrate. and the housing 5; the light distribution lens 3 is provided with a front-to-back ventilation hole 6, the rear end of the ventilation hole communicates with the installation hole 7 on the circuit board, and a metal heat dissipation pipe 8 is fixedly installed in the installation hole; the metal heat dissipation pipe 8 The front end communicates with the vent hole 6, and the rear end air outlet protrudes from the back of the housing 5. Ventilation holes 6 are evenly distributed along the circumference on the light distribution lens with multiple (such as figure 2 ). The metal heat dissipation pipes 8 installed in each installation hole 7 are...

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Abstract

The invention belongs to lighting lamps and relates to an LED lamp high in heat dissipation capability. The LED lamp high in heat dissipation capability comprises a circuit substrate provided with an LED chip on the front side. The LED chip and the front side of the circuit substrate are packaged through a hemispherical light distribution lens. A drive module and a shell are installed on the back side of the circuit substrate. The light distribution lens is provided with vent holes, each of which is through front and back. The rear ends of the vent holes are communicated with corresponding mounting holes in the circuit substrate. Metal heat dissipation tubes are fixedly installed in the mounting holes. The front ends of the metal heat dissipation tubes are communicated with the vent holes, and air outlets in the back ends of the metal heat dissipation tubes stretch out of the back side of the shell. According to the LED lamp high in heat dissipation capability, on the one hand, because airflow passages, each of which is through front and back, are formed by the vent holes and the metal heat dissipation tubes, the effect of heat dissipation through convection is enhanced; on the other hand, because the metal heat dissipation tubes are directly connected with the circuit substrate, heat dissipation through conduction is faster and more effective, and accordingly the heat dissipation capability of the LED lamp is improved on the whole.

Description

technical field [0001] The invention belongs to lighting fixtures, and relates to an LED lighting fixture with high heat dissipation capacity. Background technique [0002] As a high-power LED lamp as a lighting source, its heat dissipation is a prominent problem that needs to be solved first. Especially for LED lamps with lens packages on the front, it is more difficult to dissipate heat. The usual heat dissipation method is to install a radiator with cooling fins on the back of the circuit substrate of the LED chip, and dissipate the heat generated by the LED through the radiator. Since the radiator is located on the opposite side of the LED chip on the circuit substrate, the heat generated by the LED It needs to pass through the circuit substrate, heat dissipation adhesive layer, and heat sink. Due to the influence of the thermal conductivity of the material and the thermal conductivity area during the heat transfer process, the heat dissipation effect cannot be ideal. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21V29/83F21Y115/10F21K9/237F21V29/50
Inventor 徐征赵谡玲
Owner 北京交通大学长三角研究院
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