External resonant capacitance electronic module packaging circuit for double-interface intelligent card

Abstract

The invention discloses an external resonant capacitance electronic module packaging circuit for a double-interface intelligent card. According to the method, a resonant capacitance of the intelligent card can be arranged in an electronic module package, an additional resonant capacitance is not required inside a chip and only a stray capacitance of the circuit exists in the chip, so that the area of the chip is reduced and the processing cost of the chip is reduced; moreover, by adopting the method, an electronic module with an external resonant capacitance is compatible to an existing process and processes do not need to be increased.

Description

technical field [0001] The invention relates to an electronic module packaging method for an external resonant capacitor in a dual-interface smart card. The non-contact interface of a dual-interface smart card usually consists of a resonant inductor, a resonant capacitor and an internal circuit of the chip to form a whole resonant system, and the main components of the resonant capacitor are usually It is implemented inside the chip, which will occupy a larger chip area and increase the production cost of the chip. The present invention proposes an electronic module packaging method with an external resonant capacitor that is implemented outside the chip, which can be achieved without adding any process. Lower the area cost of the smart card chip. Background technique [0002] At present, the dual-interface smart cards widely used in banks, electronic passports and other fields usually refer to smart cards with a contact interface conforming to the ISO / IEC7816 standard and a...

AI Technical Summary

Problems solved by technology

Due to the limitation of the chip processing technology, the capacitance provided inside the chip usually occupies a relatively large area, which increases the production cost of the chip. This invention proposes an electronic module packaging method with an external resonant capacitor for a dual-interface smart card. It utilizes the existing technology. The electronic module packaging is improved, and a method of external resonant capacitor is realized, which can reduce the area cost of the smart card chip without increasing any electronic module packaging process

Images