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PCB containing stepped copper thickness patterns and manufacturing method thereof

A PCB circuit board and copper thickness technology, applied in the reinforcement of conductive graphics, printed circuit manufacturing, printed circuits, etc., can solve the problem that the uniformity of copper thickness cannot meet the design requirements, and achieve the effect of good reliability and simple process

Inactive Publication Date: 2014-04-16
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology

[0003] In the prior art, there is a method of first making thick copper and then thin copper. In this method, the method of electroplating first and then reducing copper is used in the preparation of the thin copper part. In this way, the preparation of the thin copper part has gone through two electroplating and 1 Copper reduction operation, the uniformity of copper thickness is difficult to meet the design requirements

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  • PCB containing stepped copper thickness patterns and manufacturing method thereof
  • PCB containing stepped copper thickness patterns and manufacturing method thereof
  • PCB containing stepped copper thickness patterns and manufacturing method thereof

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Embodiment Construction

[0030] The present invention will be further elaborated below in conjunction with the accompanying drawings and embodiments.

[0031] In this embodiment, a method for preparing a PCB circuit board comprising a stepped copper thickness pattern, the PCB circuit board includes a thick copper region 103 and a thin copper region 101 on the board surface, and the preparation method includes the following steps:

[0032] (1) Whole board electroplating (refer to figure 1 ): Electroplating the entire copper surface of the PCB circuit board to make the copper thickness meet the copper thickness requirements of the thin copper area;

[0033] (2) The first graphics transfer (refer to figure 2 ): through the dry film 102, etching, and film removal process, the circuit of the thin copper area is made on the PCB circuit board obtained in step (1);

[0034] (3) thickened copper (refer to Figure 3-Figure 5 ): paste the dry film to cover the thin copper area, and then carry out electroplat...

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Abstract

The invention discloses a PCB containing stepped copper thickness patterns and a manufacturing method of the PCB. The board face of the PCB comprises a thick copper area and a thin copper area. The manufacturing method includes the following steps of (1) whole board electroplating, (2) pattern transfer for the first time, (3) copper thickening and (4) pattern transfer for the second time, and then the PCB containing the stepped copper thickness patterns is obtained. According to the manufacturing method, the thin copper area is firstly manufactured, then the thick copper area is manufactured, the requirements for accuracy of the thin copper area can be met, and moreover control over the copper thickness is mainly achieved through the step of copper plating, so that the process is simple, and reliability is good.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a PCB circuit board including a stepped copper thickness pattern and a preparation method thereof. Background technique [0002] Some PCB circuit boards will have copper thickness requirements when designing, such as radio frequency lines. The parameters of electroplating and other processes are used to control the copper thickness. However, this method can only achieve the same copper thickness of the entire board, and if the local copper thickness is required to be thinner (for example, 0.5oz), the entire board is controlled according to the thinner copper thickness, and if the post-process uses the plating process, It is very easy to produce the risk of exposed base material when grinding the plate, and the scrap rate is high. And because the entire board is controlled to a thinner copper thickness, the reliability will be reduced. Therefore, a method is need...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/24
Inventor 曾志军彭浪董浩彬
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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