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High-frequency signal transmission line and electronic equipment

一种信号线路、传输线路的技术,应用在高频匹配器、电路、印刷电路等方向

Active Publication Date: 2014-04-16
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the characteristic impedance of the signal line may deviate from the specified characteristic impedance

Method used

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  • High-frequency signal transmission line and electronic equipment
  • High-frequency signal transmission line and electronic equipment
  • High-frequency signal transmission line and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0039] (Structure of high frequency signal transmission line)

[0040] Hereinafter, the structure of the high-frequency signal transmission line according to Embodiment 1 of the present invention will be described with reference to the drawings. figure 1 It is an external perspective view of the high-frequency signal transmission line 10 according to the first embodiment. figure 2 It is an exploded view of the dielectric body 12 of the high-frequency signal transmission line 10 according to the first embodiment. image 3 It is a cross-sectional configuration diagram of the high-frequency signal transmission line 10 according to the first embodiment. Figure 4 It is an external perspective view and a cross-sectional structural view of the connector 100b of the high-frequency signal transmission line 10. in Figure 1 to Figure 4 Here, the lamination direction of the high-frequency signal transmission line 10 is defined as the z-axis direction. In addition, the longitudinal directio...

Embodiment approach 2

[0087] (Structure of high frequency signal transmission line)

[0088] Hereinafter, the structure of the high-frequency signal transmission line according to Embodiment 2 of the present invention will be described with reference to the drawings. Picture 9 It is an exploded view of the dielectric body 12 of the high-frequency signal transmission line 10a according to the second embodiment. Picture 10 It is a cross-sectional configuration diagram of a high-frequency signal transmission line 10a according to the second embodiment. Regarding the appearance perspective view of the high-frequency signal transmission line 10a, quote figure 1 .

[0089] Such as figure 1 with Picture 9 As shown, the high-frequency signal transmission line 10a includes a dielectric body 12, external terminals 16 (16a, 16b), connecting conductors 17 (17a, 17b), signal lines 20, ground conductors 22, 24, via-hole conductors b11 to b14, B1 to B6 and connectors 100a, 100b.

[0090] When viewed in plan from the...

Embodiment approach 3

[0131] (Structure of high frequency signal transmission line)

[0132] Hereinafter, the structure of a high-frequency signal transmission line according to Embodiment 3 of the present invention will be described with reference to the drawings. Picture 12 It is an exploded view of the dielectric body 12 of the high-frequency signal transmission line 10b according to the third embodiment. In addition, the external perspective view of the high-frequency signal transmission line 10b is cited figure 1 .

[0133] The main difference between the high-frequency signal transmission line 10b and the high-frequency signal transmission line 10a is that the ground conductor 24 is not provided. Hereinafter, a detailed description will be given centering on the difference.

[0134] Such as figure 1 and Picture 12 As shown, the external terminal 16a is a rectangular conductor disposed near the center of the surface of the connecting portion 18a-b. Such as figure 1 and Picture 12 As shown, the e...

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PUM

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Abstract

Provided is a high-frequency signal transmission line and electronic equipment capable of limiting the characteristic impedance in a connector from deviating from a specific characteristic impedance. A dielectric body (12) is formed by stacking a plurality of dielectric sheets (18). A signal line (20) is provided in the dielectric body (12). A connector is installed at one main surface of the dielectric body (12) and is electrically connected to the signal line (20). A ground conductor (25) is provided closer to the other main surface of the dielectric body (12) than the signal line (20), and the ground conductor faces the signal line (20) with a dielectric sheet (18) therebetween. In connection sections (12b, 12c), when viewed in plan view from the z-axis direction, non-formation sections (Oa, Ob) in which conductors are not provided are disposed in at least a portion of regions that overlap the signal line (20). Adjustment conductors (15a, 15b) are provided on the other main surface of the dielectric body (12), and when viewed in plan view from the z-axis direction, overlap at least a portion of the non-formation sections (Oa, Ob).

Description

Technical field [0001] The present invention relates to a high-frequency signal transmission line and electronic equipment, and more particularly to a high-frequency signal transmission line and electronic equipment formed by arranging a signal line on a blank made of laminated insulator layers. Background technique [0002] As a conventional high-frequency signal transmission line, for example, a microstrip flexible substrate connection line described in Patent Document 1 is known. In this microstrip flexible substrate connection line, a thin flexible dielectric substrate is sandwiched in between to form a microstrip line. This kind of microstrip flexible substrate connection line is thinner than coaxial cable. Therefore, it is easy to arrange the microstrip flexible substrate connection line in a narrow space in the wireless communication terminal. [0003] When connecting circuit boards to each other using the microstrip flexible substrate connection wire described in Patent D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/08H05K1/02
CPCH05K1/0253H05K2201/09327H05K2201/09618H01P3/08H05K2201/09727H03H7/38H05K2201/09672H05K1/0225
Inventor 饭田汗人多胡茂
Owner MURATA MFG CO LTD
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