Polishing device and method for improving uniformity of chemical mechanical polishing by means of same

Abstract

The invention relates to the field of manufacture of large scale integrated circuits, in particular to a polishing device and a method for improving uniformity of chemical mechanical polishing by means of the same. A polishing head provided with a clamping groove is utilized to perform a chemical mechanical polishing process, air flows are introduced into the clamping groove to generate air pressure, so that a circular steel ring moves in the clamping groove of the polishing head, namely, relative height of a buckling ring and a film is adjusted by means of the buckling ring moves relative to the film, the relative height is kept unchanged, polishing uniformity of the chemical mechanical polishing is effectively improved, service life of the buckling ring is prolonged, and processing cost is reduced.

Description

technical field [0001] The invention relates to the field of large-scale integrated circuit manufacturing, in particular to a grinding device and a method for improving the uniformity of chemical mechanical grinding by using the device. Background technique [0002] In the existing equipment, the buckle is bonded to the circular steel ring of the grinding head by using an adhesive, and the circular steel ring is fixed on the grinding head by screws to carry out the continuous chemical grinding process (Chemical MechanicalPolishing, CMP). ), although this design method will increase the stability of grinding, but the disadvantage is that the buckle is fixed and cannot be moved, and because the buckle of the grinding machine is a consumable, it will be gradually consumed by friction during the chemical mechanical grinding process , correspondingly, its thickness will gradually decrease with the increase of use time, which will lead to a decrease in the relative height between ...

AI Technical Summary

Problems solved by technology

[0002] In the existing equipment, the buckle is bonded to the circular steel ring of the grinding head by using an adhesive, and the circular steel ring is fixed on the grinding head by screws to carry out the continuous chemical grinding process (Chemical MechanicalPolishing, CMP). ), although this design method will increase the stability of grinding, but the disadvantage is that the buckle is fixed and cannot be moved, and because the buckle of the grinding machine is a consumable, it will be gradually consumed by friction during the chemical mechanical grinding process , correspondingly, its thickness will gradually decrease with the increase of use time, which will lead to a decrease in the relative height of the buckle and the diaphragm

[0005] However, frequent replacement of the buckle will lead to high production costs and cannot fundamentally solve the problem. Since the loss of the thickness of the buckle is difficult to monitor during the use of the buckle, it is difficult to accurately quantify the use time of the buckle. It has a very large negative impact on adjusting the grinding uniformity in the chemical mechanical grinding process

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