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Case and communication product

A chassis and ventilation hole technology, applied in the field of communication, can solve the problems of backflow and affect heat dissipation, and achieve the effect of preventing air backflow and ensuring heat dissipation performance.

Active Publication Date: 2014-04-30
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual operation, when the FRU module is pulled out of the chassis, the air duct of the system will change, and serious backflow will occur, seriously affecting heat dissipation

Method used

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  • Case and communication product
  • Case and communication product
  • Case and communication product

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see figure 1 , figure 2 and image 3 , a communication product 100 includes a chassis 10 , a first module 20 and a second module 30 . The cabinet 10 is provided with a first receiving chamber 12 and a second receiving chamber 14, and the cabinet 10 includes a partition 16, and the partition 16 is located between the first receiving chamber 12 and the second receiving chamber 14 , the first storage cavity 12 is used to accommodate the first module 20...

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Abstract

The invention discloses a case. A first containing cavity and a second containing cavity are arranged in the case. The case comprises a partition board located between the first containing cavity and the second containing cavity, the first containing cavity is used for holding a first module, the second containing cavity is used for holding a second module, and the partition board is provided with a ventilation hole for communicating the first containing cavity with the second containing cavity. The case further comprises a wind shielding plate connected to the partition board in a sliding mode, the wind shielding plate is used for shielding the ventilation hole when the second module leaves the second containing cavity, and when the second module is inserted into the second containing cavity, the second module drives the wind shielding plate to slide relative to the partition board to leave the ventilation hole. The invention further provides a communication product. According to the case and the communication product, air return can be prevented, and radiating performance of the case is guaranteed.

Description

technical field [0001] The invention relates to the communication field, in particular to a case and a communication product including the case. Background technique [0002] In the system heat dissipation design of communication and IT equipment, in order to ensure the reliability of system operation, when system maintenance is required, when the fan and other FRU modules are pulled out, the system can still operate reliably. However, in actual operation, when the FRU module is pulled out of the chassis, the air duct of the system will change, and in severe cases, backflow will occur, seriously affecting heat dissipation. [0003] Therefore, how to design a chassis with an anti-backflow mechanism to prevent backflow when the FRU module is pulled out of the chassis is the focus of research in the industry. Contents of the invention [0004] The technical problem to be solved by the embodiments of the present invention is to provide a chassis and a communication product wi...

Claims

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Application Information

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IPC IPC(8): H05K5/02H05K7/20
Inventor 颜俐君李刚锋杨利新
Owner HUAWEI TECH CO LTD
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