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A heat dissipation device with efficient heat dissipation performance for a computer mainboard

A technology of heat dissipation performance and heat dissipation device, which is applied in electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of poor heat dissipation, cooling, and no active cooling device, etc., to ensure heat dissipation performance and efficient heat dissipation. performance effect

Inactive Publication Date: 2019-04-12
XIAN ZHIYUEDA SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing cooling devices for computer motherboards have the following two problems, the first: only one blowing fan is used to dissipate heat, and no exhaust fan is provided, and part of the heat is still hovering around the computer motherboard and cannot be discharged, resulting in poor heat dissipation; Most of the cooling devices for computer motherboards do not have active cooling devices, and cannot effectively cool down when the computer motherboard is running under heavy load.

Method used

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  • A heat dissipation device with efficient heat dissipation performance for a computer mainboard
  • A heat dissipation device with efficient heat dissipation performance for a computer mainboard
  • A heat dissipation device with efficient heat dissipation performance for a computer mainboard

Examples

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Embodiment approach

[0025] As a preferred embodiment of the present invention, the left end and the right end of the bottom surface of the rubber pad 20 are respectively provided with adhesive areas 21, and the adhesive areas 21 are coated with self-adhesive, through which the low-temperature sheet 11 is glued. Connected to the computer motherboard.

[0026] As a preferred embodiment of the present invention, the exhaust port of the large air duct 6 extends all the way to the outside of the computer case, so as to ensure that the heat near the computer motherboard can be dissipated to the outside of the computer.

[0027] As a preferred embodiment of the present invention, the refrigerant liquid 15 is kerosene, which will not cause a short circuit of the computer motherboard due to leakage.

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Abstract

The invention discloses a heat dissipation device with efficient heat dissipation performance for a computer mainboard. The device comprises a mounting frame, blowers fan and exhaust fans. Two air blowing pipelines and three air draft pipelines are arranged on the mounting frame, the air draft pipelines are distributed on the two sides of the air blowing pipelines, the blowers are fixedly installed in the air blowing pipelines, the exhaust fans are fixedly installed in the air draft pipelines, air guide covers are fixedly installed at the tops of the air draft pipelines, and the ends, away from the air draft pipelines, of the air guide covers are communicated with one ends of small air pipes. According to the heat dissipation device for the brain main board, air is blown through the blowers, heat of a computer main board is taken away along with air, the heat near the computer main board is pumped out of a computer through the exhaust fans, and the heat dissipation performance of the computer main board is guaranteed.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for a computer motherboard with high heat dissipation performance. Background technique [0002] The radiator transfers the heat generated by machinery or other appliances during the working process in time to avoid affecting the normal operation of the device or instrument; the function of the computer radiator is to absorb and dissipate the heat to the inside or outside of the chassis to ensure the safety of computer components. The temperature is normal, through contact with the heat-generating components, absorbing, and then transferring the heat to a distant place through various methods. [0003] Existing cooling devices for computer motherboards have the following two problems, the first: only one blowing fan is used to dissipate heat, and no exhaust fan is provided, and part of the heat is still hovering around the computer motherboard and cannot be d...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 周师青
Owner XIAN ZHIYUEDA SOFTWARE CO LTD
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