Method for encapsulating chip with excellent radiating performance
A technology of chip packaging and heat dissipation performance, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid state devices, etc., can solve problems affecting chip stability and limited heat dissipation capacity, and achieve easy packaging process, excellent heat dissipation performance and practicality good performance effect
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[0015] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so that the protection scope of the present invention can be more clearly defined.
[0016] figure 1 It is a process step diagram of a chip packaging method with excellent heat dissipation performance according to an embodiment of the present invention; the chip packaging method mainly includes the following steps: a) mounting a substrate, b) mounting a chip, c) performance testing, d) sealing and packaging, e ) Coating heat dissipation layer, f) Finished product inspection.
[0017] The specific implementation steps are as follows:
[0018] a) To install the substrate, first, apply thermosetting adhesive between the substrate and the circuit board, and the thickness of the adhesive layer is controlled within 10-20um; then, use ...
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