Product
Patsnap Eureka
For R&D, Patsnap Eureka makes reading and utilizing patents & technical documents easy.
Patsnap Eureka AIR
Designed for self-driven R&D workflows. Generate viable solutions, solve complex R&D challenges, empower your innovation with AI.
Patsnap Eureka Materials
Designed for material experts only. Revolutionize your material R&D, from search, analyze, to developing new materials.
Feature
TechResearch
Generate reliable direction feasibility study reports for your R&D in just a few steps.
TechSeek
Discover and master advanced knowledge NOW. Basics, ideas, possibilities, all at once.
TechMind
As an expert in R&D Theories, TechMind can generates customized viable solutions instantly.
TechRisk
Analyze your overall solution with one click, know your potential R&D risks in advance.
TechMonitor
Get weekly tech updates, stay abreast of the latest tech innovations and key insights.
Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
169results about How to "Good cooling performance" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
A kind of led device and led module device thereof
ActiveCN102290524AGood cooling performanceImprove luminous efficiencySolid-state devicesSemiconductor devicesGallium nitrideEngineering
The invention belongs to the technical field of a LED (Light Emitting Diode), in particular disclosing an LED (Light Emitting Diode) device and an LED (Light Emitting Diode) module device thereof. The LED (Light Emitting Diode) device comprises a substrate and a plurality of LED (Light Emitting Diode) device chips which are inversely arranged on the substrate, wherein an insulating layer of the substrate is made of a diamond-like carbon (DLC) film or a diamond film; first heat dissipation layers are arranged on the upper surfaces of a P region metal electrode layer and an N region metal electrode layer of the substrate and between the P region metal electrode layer and the N region metal electrode layer; the first heat dissipation layers are also made of the diamond-like carbon (DLC) films or diamond films; and a high reflecting layer is arranged on the upper surface of the first heat dissipation layer or on the lower surface of the P type gallium nitride of the LEDs (Light Emitting Diode). The LED (Light Emitting Diode) device is packaged to obtain the LED (Light Emitting Diode) module device of the invention. The invention has the advantages of obtaining better heat dissipation performance and luminous efficiency through the improvement of the material and the structure and being suitable for the development requirement of a LED (Light Emitting Diode).
Owner:APT ELECTRONICS
Hydraulically-driven vehicle chassis and construction machinery
InactiveCN103144537AGood cooling performanceReduce pressure shockControl devicesMotor driveEngineering
The invention discloses a hydraulically-driven vehicle chassis which comprises an engine, a variable pump, at least four wheels, at least four variable-displacement motors, at least two reversing valves and an oil tank, wherein the engine drives the variable pump to pump oil; the variable pump provides hydraulic oil to each variable-displacement motor through the reversing valves; each variable-displacement motor drives one wheel to rotate; each reversing valve controls an oil in / out oil line of two variable-displacement motors on the coaxial wheels; and the return oil line of each variable-displacement motor is communicated with the oil tank. The invention further provides construction machinery. According to the invention, a hydraulic return circuit is an opened system, and the hydraulic system has good radiating performance, and small pressure impact. The vehicle speed can be improved through controlling the variable pumps and the discharge capacity of the variable-displacement motors, and vehicle speed adjustment range can be further expanded as some variable-displacement motors are reduced to zero in discharge capacity, so that the starting acceleration is large and the speed regulation range is wide.
Owner:SANY HEAVY IND CO LTD (CN)
Heat-dissipation graphite powder mixed plastic material
InactiveCN102093691AGood cooling performanceGood heat transfer coefficientHeat-exchange elementsThermoplasticPlastic materials
The invention discloses a heat-dissipation graphite powder mixed plastic material which comprises thermoplastic or thermosetting plastics. Heat-dissipation graphite powder, which accounts for 20-60 wt%, is uniformly mixed in the thermoplastic or thermosetting plastics. Since the heat-dissipation graphite powder is added into the plastic material disclosed by the invention, the particles of the graphite powder are orderly arranged to some extent to form microchannel carbon tubes, and each heat-dissipation channel is composed of a plurality of microchannels, thereby generating the chimney effect. When being installed on the surface of a heat source, the plastic material has favorable heat-dissipation performance. When being mixed in the plastic material, the graphite powder can modify the plastic material, so that the plastic material has favorable coefficient of heat transfer, and has the effects of shielding electromagnetic waves, blocking secondary radiation and the like.
Owner:黄柱联
Manufacturing method of gallium-nitride-based high-electron-mobility transistor of flip-chip structure
InactiveCN104538304AGood cooling performanceEnable device integrationSemiconductor/solid-state device manufacturingSemiconductor devicesAluminiumHigh-electron-mobility transistor
The invention provides a manufacturing method of a gallium-nitride-based high-electron-mobility transistor of a flip-chip structure. The manufacturing method comprises the steps that a low-temperature nucleating layer, a gallium nitride high-resistance layer, a high-mobility gallium nitride layer, an aluminum nitride insertion layer, an aluminum-gallium-nitrogen barrier layer and a gallium nitride capping layer are sequentially grown on a sapphire substrate in an epitaxial mode to form an epitaxial wafer; soaking and washing are conducted; a metal layer is manufactured on a mesa and the gallium nitride capping layer; two windows are manufactured, insulating Si3N4 passivation films are manufactured in the windows, and a Schottky contact electrode as a grid electrode is formed between the two windows; the sapphire substrate is thinned; a flip-chip metal welding flux layer corresponding to an ohmic contact electrode of a source electrode and a flip-chip metal welding flux layer corresponding to an ohmic contact electrode of a drain electrode are manufactured; an electrode lead of the source electrode, an electrode lead of the drain electrode and an electrode lead of the grid electrode are manufactured; a tube core is welded to a supporting body in a flip-chip mode; a Si3N4 protective layer is formed on the surface of the tube core in a vapor deposition mode, and then manufacturing is completed.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Heat dissipation circuit board embedded with ceramic and preparation method of circuit board
ActiveCN107708315AGood cooling performanceFlat and dense surfaceSuperimposed coating processCircuit precursor manufactureCopper platingElectroplating
The invention relates to the manufacturing field of a circuit board, and specifically relates to a heat dissipation circuit board embedded with ceramic and a preparation method of the circuit board. The preparation method of the heat dissipation circuit board embedded with ceramic at least comprises the following steps of a, processing of copper-clad plates: putting a prepreg between two one-sidedcopper-clad plates and then performing fixation by a rivet, and processing windows in the one-sided copper-clad plates; b, processing of a ceramic substrate: plating a titanium layer on the upper andlower surfaces of the ceramic substrate through a first sputtering process separately, then plating a first copper layer through a second sputtering process, next, plating a second copper layer by afirst electroplating process, and finally cutting into ceramic blocks, wherein the dimensions of the ceramic blocks are matched with those of the windows; and c, lamination: embedding the cut ceramicblocks into the widows and then performing lamination; d, hole drilling: processing conductive holes in the one-sided copper-clad plates; and e, copper plating: depositing a third copper layer in theconductive holes through a chemical copper plating way and then plating a fourth copper layer through a second electroplating process.
Owner:江苏贺鸿电子有限公司
Ultra-thin aluminum foil plate water-based punching drawing oil and production method
InactiveCN101255377AGood cooling performanceRelatively low viscosityAdditivesCorrosionTriethanolamine
The invention discloses a water-based stamping stretching oil for ultra-thin aluminum foil plate which has good lubricant and cooling performance, can prevent appearance of scratch and corrosion on surface of stamping workpiece, can guarantee surface finish quality and cleanness, and method for production. Used raw materials and weight percentages are phytic acid 0.4-0.6%, sodium benzoate 1.4-1.8%, triethanolamine 2.0-2.4%, geoceric acid 0.6-1.0%, sulfonated castor oil 3.5-4.5%, polyethyleneglycol 2.4-2.8%, polyoxyethylene alkyl ether 2.4-2.8%, glycyl alcohol 1.8-2.2%, de-ionized water 82-85%, bactericidal agent 0.1-0.2%. The product is produced under synthesis condition of normal temperature - medium temperature - normal temperature.
Owner:DALIAN SANDAAOKE CHEM
LED (Light Emitting Diode) bubble lamp
ActiveCN103411147AImprove circulation speedGood cooling performancePoint-like light sourceLighting heating/cooling arrangementsLED circuitLight head
Owner:SHANGHAI YAMING LIGHTING
Flip chip plastic package structure with cooling structure and manufacturing method
InactiveCN104241218ALow costGood cooling performanceSemiconductor/solid-state device detailsSolid-state devicesEngineeringSemiconductor
The invention discloses a flip chip plastic package structure with a cooling structure and a manufacturing method, and relates to the technical field of semiconductors. According to the flip chip plastic package structure with the cooling structure and the manufacturing method, a chip and height limiting blocks are arranged on the first face of a base plate, a cooling plate is arranged on the chip and the height limiting blocks, and a first space formed by the cooling plate, the chip, the height limiting blocks and the base plate is filled with plastic package resin. In other words, through the cooling plate on the height limiting blocks and the chip, the plastic package structure is manufactured without molds, and the flip chip plastic package structure with the cooling structure and the manufacturing method have the advantage that cost is low.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
Diamond micro-channel Cu-based CVD diamond heat sink sheet and preparation method thereof
ActiveCN110557936AEasy to peelGood cooling performanceModifications by conduction heat transferHeat sinkNanotechnology
The invention discloses a diamond micro-channel Cu-based CVD diamond heat sink sheet and a preparation method thereof. The diamond micro-channel Cu-based CVD diamond heat sink sheet sequentially comprises a Cu substrate, a micro-through-hole template and a CVD diamond film from bottom to top, wherein the Cu substrate and the micro-through-hole template are provided with nano-diamond particles therebetween, the Cu substrate is embedded with a diamond micro-channel array, the diameter of each diamond micro-channel ranges from 0.3mm to 0.5mm, and the distance between every two micro-channels ranges from 2mm to 3mm. The heat dissipation effect of the heat sink sheet is superior to that of traditional heat sink sheets such as Ag, Cu and Al; the heat dissipation performance of the micro-channelCu-based diamond heat sink sheet is better; the nucleation density and the growth rate of diamond in the micro-through-hole are greatly improved; and the CVD selective growth of the diamond film is realized in the micro-through holes.
Owner:SHAANXI UNIV OF SCI & TECH
Method for preparation of three-dimensional ordered macroporous Ce-Zr material by using PMMA as template
ActiveCN103409653ALarge specific surface areaGood cooling performanceMetal/metal-oxides/metal-hydroxide catalystsIonChemistry
The invention provides a method for preparation of a three-dimensional ordered macroporous Ce-Zr material by using PMMA as a template. The method is as below: mixing cerium nitrate and zirconium nitrate, and adding deionized water to prepare a solution; adding citric acid, stirring at 20-90 DEG C, and adding a PMMA template and mixing; standing at normal temperature, drying at 30-90 DEG C for 12-24 h to obtain a crude product, and removing the moisture in the crude product; and heating the crude product to 450-600 DEG C and maintaining a constant temperature for 2-4 h to obtain the three-dimensional ordered macroporous Ce-Zr material. The material has great specific surface area, excellent heat radiation performance, and large and uniform apertures arranging in a three-dimensional ordered state, so that reactants can arrive the active site easily; the macropores are connected through hole windows to form an open three-dimensional macroporous network structure; and the above structure characteristics are beneficial to contact, diffusion and transmission of substances in the 3 DOM material. The material can be applied to methane steam reforming hydrogen production and synthetic gas technology, so as to substantially increase catalytic activity and yield of the reaction.
Owner:KUNMING UNIV OF SCI & TECH
Dustproof plug-in box with high heat dissipation performance
ActiveCN110198622AGuaranteed protection performanceGood cooling performanceCooling/ventilation/heating modificationsElectricityForeign matter
The invention discloses a dustproof plug-in box with a high heat dissipation performance, and belongs to the technical field of electricity. The dustproof plug-in box comprises an air duct component,wherein a heat dissipation module is plugged into the air duct component to form an independent air duct structure after matching; the air duct component is arranged in the dustproof plug-in box, andthe dustproof plug-in box comprises a box upper cover plate and a box lower cover plate which are connected through two oppositely arranged box side plates. According to the invention, the internal structure of the standard plug-in box is redesigned, and the air duct component and the heat dissipation module matched with the standard plug-in box are designed, so that the heat of the heat source chip is transferred to the heat dissipation module and dissipated outside the plug-in box through the air duct component, the invasion of dust and foreign matters caused by opening air holes is avoided,and the heat dissipation performance and the environmental adaptability of the plug-in box are enhanced; the number and the installation positions of the air duct components can be flexibly configured, the reasonable layout of the plug-in units is facilitated, the anti-interference capability of the circuit is improved, and the internal wiring of the device is optimized.
Owner:NARI TECH CO LTD +1
Chip packaging structure with good heat radiation performance
InactiveCN102347293AGood cooling performanceEnsure efficient operationSemiconductor/solid-state device detailsSolid-state devicesRadiationElectrical and Electronics engineering
The invention discloses a chip packaging structure with a good heat radiation performance. The chip packaging structure mainly comprises a substrate, a chip, a pin body, sealing glue and a heat abstractor. The structure is characterized in that: the chip is arranged above the substrate and is completely located in the sealing glue; the chip is electrically connected with one end of the pin body through a lead and the other end of the pin body stretches out of the sealing glue to be connected with an externally-arranged circuit board; the heat abstractor is arranged above the chip, one end of the heat abstractor is contacted with the upper surface of the chip and the other end stretches out of the sealing glue to radiate heat. The invention discloses the chip packaging structure with the good heat radiation performance, and the heat abstractor which is internally arranged in the chip packaging structure can be used for effectively transferring and dissipating the heat energy released by the chip in the sealing glue so that the efficient operation of the chip is ensured; and meanwhile, the chip packaging structure provided by the invention is simple in process implementing and low in cost and is suitable for the production in batches.
Owner:常熟市广大电器有限公司
Heat dissipation type solar cell back film
ActiveCN104201225AGood cooling performanceGood thermal conductivitySynthetic resin layered productsPhotovoltaic energy generationOperating temperaturePolyester
The invention relates to a heat dissipation type solar cell back film. The film comprises a weather-proof layer, a base material and an adhesive layer, wherein the base material is made from a heat dissipation type polyester film, and the heat dissipation type polyester film is formed by successively placing a polyester layer, a first heat conducting polyester layer and a second heat conducting polyester layer from top to bottom. The first heat conducting polyester layer contains first heat conducting particles occupying 5%-20% polyester weights of the first heat conducting polyester layer, the second heat conducting polyester layer contains second heat conducting particles occupying 5%-30% polyester weights of the second heat conducting polyester layer, and surface grafting treatment is performed on the first heat conducting particles and the second heat conducting particles by a hyperbranched polymer. The heat dissipation type solar cell back film has the advantages that the heat dissipation property, the heat conducting property and the film forming property are good; the heat quantity generated by a solar cell module is discharged in time; the operating temperature of a solar cell is reduced; the transfer efficiency of the solar cell is improved; and the service life of the solar cell is prolonged.
Owner:乐凯胶片股份有限公司
Plunger type hydraulic motor pump internally integrated with front-mounted pump
ActiveCN103967802AGood cooling performanceIncreased import pressurePump componentsPump installationsCylinder blockSwash
The invention discloses a plunger type hydraulic motor pump internally integrated with a front-mounted pump. The plunger type hydraulic motor pump comprises a motor rotor, a cylinder body, a plurality of plungers, a swash plate assembly, a distribution valve assembly, a front-mounted pump assembly, bearings and a thrust plate, wherein the two ends of the cylinder body are provided with stepped shafts, the end of each stepped shaft is provided with a water discharging end, a water discharging through hole designed inside each stepped shaft is communicated with a water outlet formed in the corresponding water discharging end, and the two stepped shafts are embedded in the bearings which are distributed symmetrically; the stepped shaft at one end is provided with the thrust plate, and the thrust plate is embedded in a bearing block and the corresponding water discharging end; the front-mounted pump assembly is integrally installed inside a water feeding runner inside one end of the cylinder body, the front-mounted pump assembly is communicated with a plunger cavity through a distribution valve, and working media are discharged out from the two water discharging ends after being pressurized in the plunger cavity. According to the plunger type hydraulic motor pump internally integrated with the front-mounted pump, the heat dissipation performance is excellent, high-speed rotation is achieved, no cavitation is generated, vibration and noise are low, and the working media can be water or oil.
Owner:HUAZHONG UNIV OF SCI & TECH
Fireproof and compressive cable
ActiveCN110310772AGood cooling performanceGood pressure buffer capacityInsulated cablesInsulated conductorsTorsion springEngineering
The invention discloses a fireproof and compressive cable which comprises an outer cable protective layer. A cable installation cavity is in the outer cable protective layer. A cable core wire is arranged in the cable installation cavity. The outer opposite faces of the cable core wire are provided with an arc-shaped convex part respectively. Each arc-shaped convex part extends along the longitudinal direction of the cable core wire. More than one rotating groove is arranged equidistantly on both sides of the arc-shaped convex parts. A rotating shaft hole is arranged in each side of the innerwall of each rotating groove. A telescopic rod is arranged into each rotating groove. A rotating shaft is arranged on each side of the bottom of each telescopic rod. Each rotating shaft is sleeved bya torsion spring. Each rotating shaft is elastically arranged in a rotating shaft hole through a torsion spring. According to the invention, structures located on the upper and lower ends of the cablehave the functions of compression resistance and buffering; in the event of fire, an inner protective layer can be used for internal secondary protection to improve the fireproof performance of the cable core wire; the inner protective layer is folded when not used, which does not affect normal heat dissipation of the cable core wire.
Owner:JINGLAN CABLE CO LTD
Pick-up head and mobile terminal
ActiveCN105933582AGood cooling performanceImprove reliabilityTelevision system detailsColor television detailsEngineeringHeat storage material
The embodiments of the invention disclose a pick-up head and a mobile terminal. The pick-up head comprises a shooting module and a heat absorption heat storage member, wherein the shooting module comprises a base, a lens and a flexible circuit board, the base comprises a first side end and a second side end, the lens is arranged on the first side end, the flexible circuit board is connected with the second side end, the flexible circuit board is electrically connected with the lens, the heat absorption heat storage member is arranged on the shooting module, the heat absorption heat storage member comprises a heat absorption heat storage material with material attributes of heat absorption and heat storage functions, and the heat absorption heat storage material is used for absorbing and storing heat on the shooting module. By use of the pick-up head, the heat dissipation effect of the pick-up head can be improved.
Owner:GUANGDONG OPPO MOBILE TELECOMM CORP LTD
LED light emitting device and LED filament lamp
PendingCN105909990AIncrease cooling areaGood cooling performanceLighting heating/cooling arrangementsLight fasteningsElectricityPneumatic pressure
The invention provides an LED light emitting device and a filament lamp. The LED light emitting device comprises at least one LED filament, and further comprises a closed container, electric connecting wires and electrode lead-out wires; the at least one LED filament is fixed on the outer wall of the closed container through glue; the air pressure in the closed container is lower than 1 atmospheric pressure; the closed container has no heat transfer medium with phase change; and after the at least one LED filament is connected in series, in parallel or in serial and parallel by the electric connecting wires, electrodes at two ends of the filament are electrically connected with the electrode lead-out wires. The LED light emitting device has such advantages as excellent heat dissipation, no need of core column and filament mounting bracket, simple structure, low cost, firmness and vibration resistance, and is used for manufacturing the LED filament lamp.
Owner:ZHEJIANG LEDISON OPTOELECTRONICS
Efficient radiating type LED lamp
ActiveCN104132261AGood coolingGood cooling performancePoint-like light sourceLighting heating/cooling arrangementsNitrogen gasEngineering
The invention relates to the technical field of bulbs, and particularly discloses an efficient radiating type LED lamp which comprises a lamp holder, a substrate seat and a lampshade. One end of the substrate seat is connected with the lamp holder, a substrate with a circuit board is arranged at the other end of the substrate seat, a plurality of LED light emitting assemblies are arranged on the substrate, the substrate seat is in the shape of a circular truncated cone, a heat conduction plate is arranged at a large-diameter end of the substrate seat, the large-diameter end of the substrate seat axially extends to form a convex ring, the substrate is mounted in the convex ring, a small-diameter end of the substrate seat inwardly and radially extends to form a clamp ring, an isolation pipe is arranged between the clamp ring and the heat conduction plate, a closed annular radiating cavity is enclosed by the substrate seat, the isolation pipe, the clamp ring and the heat conduction plate and is filled with nitrogen or inert gas, and metal sodium is arranged inside the annular radiating cavity. The efficient radiating type LED lamp has the advantages of good radiating performance and long service life.
Owner:SHAOXING BOOM LIGHTING CO LTD
Power chip stacking and packaging structure
ActiveCN112701095ASmall sizeGood cooling performanceSemiconductor/solid-state device detailsSolid-state devicesPhysicsWire frame
The invention discloses a power chip stacking and packaging structure. The power chip stacking and packaging structure comprises a metal sheet, a first chip, a lead wire frame and a second chip which are stacked in sequence to form a stacking structure, and a packaging body for packaging the stacking structure, wherein the lead wire frame comprises a base island, a first pin electrically connected with the base island, and a second pin insulated from the base island; two opposite sides of the first chip are provided with a first electrode and a second electrode, and two opposite sides of the second chip are provided with a third electrode and a fourth electrode; the metal sheet and the first electrode, the second electrode and the base island, and the base island and the third electrode are respectively combined through conductive combination layers; the fourth electrode is electrically connected with the second pin; and the front surface of the metal sheet, a part of the first pin and a part of the second pin are exposed out of the package body. According to the power chip stacking and packaging structure, the two chips are fixed on the two opposite sides of the lead wire frame for stacking and packaging, and the metal sheets are exposed, so that the size of the packaging structure is reduced, and meanwhile, the packaging structure has better heat dissipation performance.
Owner:GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
Hybrid cooling system of electric drive system and vehicle
PendingCN112092607ALower winding temperatureGood cooling performanceGear lubrication/coolingCooling/ventillation arrangementElectric driveElectric machinery
The invention relates to the technical field of cooling of electric drive systems, in particular to a hybrid cooling system of an electric drive system and a vehicle. The hybrid cooling system of theelectric drive system comprises an oil cooling system and a water cooling system. The oil cooling system comprises a speed reducer oil conveying path, a motor oil conveying path and a plurality of motor oil spraying openings, and lubricating oil in a speed reducer shell flows through the speed reducer oil conveying path and the motor oil conveying path and is sprayed into a motor shell from the motor oil spraying openings. The motor shell comprises a heat exchange area, and lubricating oil in the motor shell can flow into the heat exchange area. The water cooling system comprises a controllerheat dissipation water path and a motor shell heat dissipation water path, cooling liquid flowing through the controller heat dissipation water path is used for cooling the controller, and cooling liquid flowing through the motor shell heat dissipation water path is used for cooling the motor shell, a stator of a motor and lubricating oil in the cooling heat exchange area. No special heat exchangedevice needs to be arranged, and the size and cost of the electric drive system are reduced.
Owner:CHINA FIRST AUTOMOBILE
Seabed medium-voltage direct-current power distribution device
ActiveCN105655895ASimple structureGood cooling performanceSubstation/switching arrangement cooling/ventilationElectric energyExternal interface
The invention relates to a seabed medium-voltage direct-current power distribution device. The seabed medium-voltage direct-current power distribution device comprises an internal functional unit and a pressure-resisting seal cavity, the internal functional unit is installed in the pressure-resisting seal cavity, the pressure-resisting seal cavity is formed by sequentially connecting a front end cover, a cylinder and a rear end cover, and a first water seal connector and a second water seal connector are installed on the front end cover; the inner functional unit comprises a heat dissipation support and comprises an external interface power supply control module, an external interface state detection module, a first medium and low voltage direct-current conversion module, a medium-voltage bus monitoring module, a second medium and low voltage direct-current conversion module, an internal environment state monitoring module, an internal load monitoring module, an Ethernet switch and a PC / 104 main controller which are installed on the heat dissipation support. Electric energy distribution is controlled flexibly, the own operation state is monitored, the power distribution device is simple in structure, good in heat dissipation performance, suitable for various large-size high-power application occasions and capable of reducing the environment temperature of an internal functional circuit, and improving reliability and stability of long-term operation.
Owner:SHANGHAI HENGTONG MARINE EQUIP CO LTD
Screen assembly and mobile terminal
InactiveCN106061198AGood cooling performanceImprove reliabilityCooling/ventilation/heating modificationsHeat generationStorage material
The invention discloses a screen assembly, which comprises a display screen module, a heat conduction member and a heat absorption and storage member, wherein the display screen module comprises a display surface and a connecting surface which are arranged back to back, the heat absorption and storage member is arranged on the connecting surface of the display screen module, the heat absorption and storage member comprises a heat absorption and storage material with material attributes of heat absorption and heat storage, and the heat conduction member is attached to the display surface and the heat absorption and storage member respectively. The invention further provides a mobile terminal. The screen assembly provided by the invention enables the heat conduction member to conduct heat on the display surface to the heat absorption and storage member through arranging the heat absorption and storage member at the connecting surface of the display screen module and respectively arranging the heat conduction member on the display surface and the heat absorption and storage member at the same time. The heat absorption and storage member comprises the heat absorption and storage material having the functions of heat absorption and heat storage, can absorb the heat conducted by the heat conduction member, and can dissipate stored heat into the air. Influences imposed on the screen assembly and the mobile terminal by heat generation are reduced.
Owner:GUANGDONG OPPO MOBILE TELECOMM CORP LTD
Fully synthetic copper and copper alloy workpiece cutting fluid
The invention discloses a fully synthetic copper and copper alloy workpiece cutting fluid which comprises the following raw material: by mass, 6-12% of polyethylene glycol (M = 400), 6-12% of diethanolamine, 6-12% of triethanolamine, 0.5-1% of ethylenediamine tetraacetic acid tetrasodium salt (EDTA 4-Na), 0.3-0.5% of benzotriazole, 1-3% of boric acid, 1-4% of butyl carbitol, 2-5% of borax, 6-12% of glycerin, 4-6% of a phosphating quality regulator, 1-3% of a soaking degreasing oil cleaning special surfactant, 0.5-1% of a defoaming agent, 0.5-1% of a fungicide and the balance of water. The fully synthetic copper and copper alloy workpiece cutting fluid optionally combines related high-quality raw materials, components are mutually compatible for action, compared with the prior art, the fully synthetic copper and copper alloy workpiece cutting fluid not only is low in cost, but also has good cooling performance, lubrication performance, cleaning performance and antirust performance, and is suitable for machining processing of copper and copper alloy workpieces, and the antirust period is more than two weeks.
Owner:DALIAN SANDAAOKE CHEM
Drive motor used for electric vehicle
InactiveCN103414287AGood cooling performanceExtend your lifeMagnetic circuit rotating partsElectric machinesDrive motorAutomotive engineering
The invention relates to a drive motor used for an electric vehicle. The drive motor comprises an engine base, a front end cover and a rear end cover, wherein the front end cover and the rear end cover are matched with the engine base. The drive motor further comprises an air cooling circulating system and a water cooling circulating system, wherein the air cooling circulating system and the water cooling circulating system are arranged inside the engine base, and the water cooling circulating system circulates between the engine base, the front end cover and the rear end cover. According to the technical scheme, the air cooling circulating system and the water cooling circulating system which circulates between the engine base, the front end cover and the rear end cover are arranged inside the engine base at the same time, the two circulating systems can be used simultaneously and effectively for dissipating heat inside the engine base, the front end cover and the rear end cover, therefore, the heat dissipation performance is good, and the service life of the drive motor is prolonged; meanwhile, the drive motor is compact in structure and small in size, thereby occupying a small space.
Owner:ANHUI ANKAI AUTOMOBILE
LED lighting equipment based on liquid circulation heat dissipation
InactiveCN107448783AReasonable structureGood cooling performanceLighting heating/cooling arrangementsSemiconductor devices for light sourcesMetal substrateEngineering
The invention discloses LED lighting equipment based on liquid circulation heat dissipation. The LED lighting equipment comprises an LED lamp cap; the LED lamp cap comprises a metal substrate and a high-power LED lamp bead arranged on the metal substrate; a liquid flow heat radiator is fixed to the metal substrate; a liquid inlet and a liquid outlet are formed in the liquid flow heat radiator; the liquid flow heat radiator is connected with an air radiator through the liquid inlet and the liquid outlet; and a liquid pipeline connected with the liquid outlet is arranged in the air radiator. Heat of the metal substrate provided with the LED lamp bead can be transferred outwards continuously through liquid circulation, thus the heat dissipation on the LED lamp cap is realized; and a liquid circulation heat dissipation structure and the air radiator in the LED lighting equipment, and the LED lamp cap can be arranged in a split manner, thus the size and the weight of the LED lamp cap are not required to be increased, and the LED lighting equipment is reasonable in structure, good in heat dissipation performance and long in service life.
Owner:北京科迪盛业技术服务有限公司
Chip heat dissipation packaging structure
ActiveCN110783288AImprove thermal performanceGood cooling performanceSemiconductor/solid-state device detailsSolid-state devicesElectric energyEngineering
The invention relates to the field of chip packaging, in particular to a chip heat dissipation packaging structure, which comprises a substrate loaded with a working chip, a semiconductor refrigeration chip arranged on the working chip for cooling the working chip, and a micro-channel chip arranged on the semiconductor refrigeration chip for cooling the semiconductor refrigeration chip. The semiconductor refrigeration chip is arranged on the working chip, and thus, heat dissipated by the working chip can be directly and actively dissipated; the semiconductor refrigeration chip is provided withthe micro-channel chip, and the micro-channel chip is used for dissipating heat of the semiconductor refrigeration chip, so that the heat dissipation efficiency of the working chip is higher, and theheat dissipation effect is obvious; and as a thermoelectric conversion layer is also arranged between the working chip and the substrate and is used for converting heat of the working chip into electric energy and driving the semiconductor refrigeration chip or the micro-channel chip to work, an external power supply is prevented from being arranged, and energy is saved.
Owner:NAT CENT FOR ADVANCED PACKAGING
Mixed ventilation cooling system and method for permanent magnet traction motor
ActiveCN106451864AUniform temperature riseGood cooling performanceMagnetic circuit rotating partsMagnetic circuit stationary partsTraction motorMagnet
The invention relates to a mixed ventilation cooling system and method for a permanent magnet traction motor. The cooling system consists of a radial ventilation cooling system and an axial ventilation cooling system which are independently driven to work, the radial ventilation cooling system is used for directly blowing and cooling a rotor and a permanent magnet, and the axial ventilation cooling system is used for cooling an end winding and balancing the temperature rise of the whole motor. According to the system and the method, radial ventilation and axial ventilation are separated in terms of mass transfer, and the wind resistance loss of the ventilation systems is relatively low; seriously heated positions in the motor are cooled by the two sets of ventilation systems respectively, so that high cooling performance is achieved; the radial ventilation cooling system is divided into two parts, namely, an air inlet passage and an air outlet passage, by a separation plate, and the temperature rise of cooling air entering each radial air vent is similar, so that axial balance of the temperature rise of the motor is ensured; circumferential balance of the temperature rise of the motor is ensured by the axial ventilation cooling system. The system and the method have the characteristics of good motor interior cooling effects and good motor temperature rise balance, and are suitable for popularization and application.
Owner:SHENYANG POLYTECHNIC UNIV
Hydrophobic heat insulation and cooling film and preparation method thereof
ActiveCN111910442AStrong absorption capacityGood cooling performanceConstructions elementsRoad vehiclesThin membranePolymer dissolution
The invention provides a hydrophobic heat insulation and cooling film and a preparation method thereof. The hydrophobic heat insulation and cooling film is a polymer porous film, the porosity is 30% -90%, the interior of the hydrophobic heat insulation and cooling film is of a spongy structure, the pore diameters of pores are distributed in a bimodal mode, and the width distribution of the poresis 0.2 micrometer - 0.6 micrometer and 1 micrometers - 5 micrometers respectively. The preparation method of the hydrophobic heat insulation and cooling film comprises the following steps of dissolving a polymer into an organic good solvent, adding a non-solvent to prepare a precursor solution, and spraying the precursor solution onto a substrate to obtain the hydrophobic heat insulation and cooling film. The hydrophobic heat insulation and cooling film is a flexible film material with good hydrophobicity, good heat insulation effect and good cooling effect, shows very excellent flexible performance, can be bent and curled at will, can be suitable for the surfaces of base bodies with different shapes, can achieve effective cooling and refrigeration inside the base bodies, and is good in application prospect and high in practicability; the preparation method of the hydrophobic heat insulation and cooling film has the advantages of simplicity, feasibility, low production cost, high filmforming efficiency and the like, is suitable for large-scale preparation and is beneficial to industrial application.
Owner:NAT UNIV OF DEFENSE TECH
Method for encapsulating chip with excellent radiating performance
InactiveCN102347246AGood cooling performanceEnsure efficient operationSemiconductor/solid-state device detailsSolid-state devicesComputer engineering
The invention discloses a method for encapsulating a chip with excellent radiating performance. The method for encapsulating the chip mainly comprises the following steps of: a) installing a substrate; b) installing the chip; c) detecting the performance of the chip; d) sealing by using a sealing gum; e) coating a heat-radiating layer; and f) detecting a finished product. The invention discloses the method for encapsulating the chip with excellent radiating performance. In the process of executing the encapsulating method, two encapsulating processes are carried out on the chip; the heat radiating performance of the chip can be effectively improved while a favorable encapsulating performance is ensured; and the high-efficiency operation of the chip is ensured. Simultaneously, in the process of executing the encapsulating method, an external auxiliary radiating device does not need to be added, thus the encapsulating cost is reduced, the encapsulating process is easy to achieve, and the practicality is excellent.
Owner:常熟市广大电器有限公司
Cooling system for wireless charging device for electric vehicle power battery
PendingCN108847333AGood cooling performanceImprove cooling effectTransformers/inductances coolingTransformersHeat sinkElectrical battery
The invention provides a cooling system for a wireless charging device for an electric vehicle power battery, which can effectively dissipate the coil; the structure is simple and reasonable; the heatdissipating efficiency is high; the cooling system for a wireless charging device for an electric vehicle power battery comprises a heat conducting layer in contact with the coil; a heat dissipatingfin layer is further arranged on the rear side of the heat conducting layer and contacts with the heat conducting layer; the heat dissipating fin layer comprises a heat dissipation sheet; and the heatdissipation sheet is made of a phase change composite material.
Owner:安洁无线科技(苏州)有限公司
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com