A kind of led device and led module device thereof
A technology for LED devices and LED modules, which is applied in the direction of electric solid state devices, semiconductor devices, electrical components, etc., can solve problems such as the reduction of light efficiency, and achieve the effect of high luminous efficiency and good heat dissipation performance.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0047] Example 1
[0048] Such as figure 2 As shown, this embodiment discloses an LED device including a plurality of LED chips 1 (only one LED chip is schematically shown in the figure) and a substrate 2. The LED chip 1 shown is flip-chip mounted on the substrate 2. .
[0049] Such as figure 1 The LED chip 1 includes a sapphire substrate 11, an N-type gallium nitride 12, a multilayer quantum well light-emitting layer 13, a P-type gallium nitride 14, a P electrode 15, a metal bump 16 and an N electrode 17. An N-type gallium nitride 12 is grown on the sapphire substrate 11, a light-emitting layer 13 is grown on the N-type gallium nitride 12, and a P-type gallium nitride 14 is grown on the light-emitting layer 13. Through photolithography, etching, metal layer deposition and passivation layer protection and other process steps, and finally through the split process, P electrodes 15 and metal bumps 16 are formed on the P-type gallium nitride 14 layer, and the N-type gallium nitride ...
Example Embodiment
[0062] Example 2
[0063] Such as image 3 As shown, the difference between this embodiment and Embodiment 1 is that the position of the highly reflective layer 3 is set on the lower surface of the P-type gallium nitride 14 of the LED chip 1.
[0064] In this embodiment, since the reflective layer 3 is provided on the P-type gallium nitride layer 14, the thickness of the first heat dissipation layer 25 deposited on the metal electrode layer can be the same as the height of the P pad 26 and the N pad 27 on the substrate 2; Since the first heat dissipation layer uses a diamond-like carbon film (DLC) or a diamond film, it has high heat dissipation, which can accelerate the lateral circulation of the heat emitted by the LED chip, and quickly introduce the heat to the metal substrate. DLC) or diamond film has excellent characteristics of hardness and wear resistance, and the diamond-like carbon film (DLC) or diamond film deposited on the metal electrode layer has a good protective effec...
Example Embodiment
[0065] Example 3
[0066] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 lies in:
[0067] (1) Diamond-like carbon film (DLC) or diamond film is also attached to the side walls of the P pad 26 and the side wall of the N pad 27 to further improve the heat dissipation effect of the LED device.
[0068] (2) The high-reflective layer 3 is a multilayer distributed Bragg reflector layer formed by alternately growing the following materials:
[0069] Indium (In), aluminum (Al), gold (Au), platinum (Pt), zinc (Zn), silver (Ag), titanium (Ti), silicon nitride (SiNx), silicon dioxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), titanium monoxide (TiO), titanium dioxide (TiO 2 ), titanium dioxide (Ti 2 O 3 ), and zirconium dioxide (ZrO 2 ).
[0070] The Bragg reflection layer is a layered structure that is periodically grown from two materials with different refractive indices, which can reflect the light directed to the substrate back to the upper surface using the p...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap