Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat dissipation circuit board embedded with ceramic and preparation method of circuit board

A circuit board and ceramic substrate technology, applied in the field of circuit board manufacturing, can solve the problems of inability to meet the requirements of LED products, difficult to popularize and apply in a large area, expensive ceramic substrates, etc., and achieves dense and flat surface, good brightness, and low internal stress. Effect

Active Publication Date: 2018-02-16
江苏贺鸿电子有限公司
View PDF12 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the metal substrate and the copper foil are laminated with insulating resin, which has poor heat dissipation and cannot meet the requirements of LED products; the ceramic substrate is expensive, and it is difficult to promote and apply it in a large area in the market; and the above two substrates are not suitable. Used in the manufacture of double-sided or multi-layer circuit boards, the circuit processing accuracy is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0029] In order to solve the above technical problems, the first aspect of the present invention provides a method for preparing a heat dissipation circuit board inlaid with ceramics, at least including the following steps:

[0030] a. Copper-clad laminate processing: place the prepreg between two single-sided copper-clad laminates and then fix them with rivets. Direct contact; a window is processed on the single-sided copper-clad laminate, and the window runs through the single-sided copper-clad laminate and the prepreg;

[0031] b. Ceramic substrate processing: plate a titanium layer on the upper and lower surfaces of the ceramic substrate through the first sputtering process, then plate the first copper layer through the second sputtering process, and then plate the second copper layer through the first electroplating process layers, and finally cut into ceramic blocks, the size of the ceramic block matches the size of the window;

[0032] c. Pressing: Insert the cut ceram...

Embodiment 1

[0097] Embodiment 1 provides a method for preparing a heat dissipation circuit board embedded with ceramics, at least including the following steps:

[0098] a. Copper-clad laminate processing: place the prepreg between two single-sided copper-clad laminates and then fix them with rivets. Direct contact; a window is processed on the single-sided copper-clad laminate, and the window runs through the single-sided copper-clad laminate and the prepreg;

[0099] b. Ceramic substrate processing: the upper and lower surfaces of the ceramic substrate are respectively plated with a titanium layer by the first sputtering process, then the first copper layer is plated by the second sputtering process, and then the second copper layer is plated by the first electroplating process. The copper layer is finally cut into ceramic blocks, the size of the ceramic block matches the size of the window;

[0100] c. Pressing: Insert the cut ceramic block into the window, and then perform pressing, ...

Embodiment 2

[0116] Embodiment 2 provides a method for preparing a heat dissipation circuit board inlaid with ceramics, at least including the following steps:

[0117] a. Copper-clad laminate processing: place the prepreg between two single-sided copper-clad laminates and then fix them with rivets. Direct contact; a window is processed on the single-sided copper-clad laminate, and the window runs through the single-sided copper-clad laminate and the prepreg;

[0118] b. Ceramic substrate processing: the upper and lower surfaces of the ceramic substrate are respectively plated with a titanium layer by the first sputtering process, then the first copper layer is plated by the second sputtering process, and then the second copper layer is plated by the first electroplating process. The copper layer is finally cut into ceramic blocks, the size of the ceramic block matches the size of the window;

[0119] c. Pressing: Insert the cut ceramic block into the window, and then perform pressing, so...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thermal conductivityaaaaaaaaaa
Thermal conductivityaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the manufacturing field of a circuit board, and specifically relates to a heat dissipation circuit board embedded with ceramic and a preparation method of the circuit board. The preparation method of the heat dissipation circuit board embedded with ceramic at least comprises the following steps of a, processing of copper-clad plates: putting a prepreg between two one-sidedcopper-clad plates and then performing fixation by a rivet, and processing windows in the one-sided copper-clad plates; b, processing of a ceramic substrate: plating a titanium layer on the upper andlower surfaces of the ceramic substrate through a first sputtering process separately, then plating a first copper layer through a second sputtering process, next, plating a second copper layer by afirst electroplating process, and finally cutting into ceramic blocks, wherein the dimensions of the ceramic blocks are matched with those of the windows; and c, lamination: embedding the cut ceramicblocks into the widows and then performing lamination; d, hole drilling: processing conductive holes in the one-sided copper-clad plates; and e, copper plating: depositing a third copper layer in theconductive holes through a chemical copper plating way and then plating a fourth copper layer through a second electroplating process.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a heat dissipation circuit board inlaid with ceramics and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics integration technology, highly integrated circuit boards have become an inevitable trend, and the volume of electronic components and logic circuits on circuit boards has been greatly reduced. increase, leading to changes in the working environment of components to high pressure and high temperature. If you want to keep electronic components working stably for a long time, you must improve the heat dissipation capacity and high-voltage resistance of the circuit board to ensure its service life and accuracy. [0003] At present, the heat dissipation of LED printed circuit boards mainly adopts metal substrates or ceramic substrates. Among them, the metal substrate and the copper foil are laminated with insul...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/02H05K1/02C23C28/02C25D3/38
CPCC23C28/023C25D3/38H05K1/0203H05K3/022
Inventor 刘统发
Owner 江苏贺鸿电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com