Heat dissipation circuit board embedded with ceramic and preparation method of circuit board

A circuit board and ceramic substrate technology, applied in the field of circuit board manufacturing, can solve the problems of inability to meet the requirements of LED products, difficult to popularize and apply in a large area, expensive ceramic substrates, etc., and achieves dense and flat surface, good brightness, and low internal stress. Effect

Active Publication Date: 2018-02-16
江苏贺鸿电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the metal substrate and the copper foil are laminated with insulating resin, which has poor heat dissipation and cannot meet the requirements of LED products; the ceramic substrate is expensive, and it is di

Method used

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Examples

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preparation example Construction

[0029] In order to solve the above technical problems, the first aspect of the present invention provides a method for preparing a heat dissipation circuit board inlaid with ceramics, at least including the following steps:

[0030] a. Copper-clad laminate processing: place the prepreg between two single-sided copper-clad laminates and then fix them with rivets. Direct contact; a window is processed on the single-sided copper-clad laminate, and the window runs through the single-sided copper-clad laminate and the prepreg;

[0031] b. Ceramic substrate processing: plate a titanium layer on the upper and lower surfaces of the ceramic substrate through the first sputtering process, then plate the first copper layer through the second sputtering process, and then plate the second copper layer through the first electroplating process layers, and finally cut into ceramic blocks, the size of the ceramic block matches the size of the window;

[0032] c. Pressing: Insert the cut ceram...

Embodiment 1

[0097] Embodiment 1 provides a method for preparing a heat dissipation circuit board embedded with ceramics, at least including the following steps:

[0098] a. Copper-clad laminate processing: place the prepreg between two single-sided copper-clad laminates and then fix them with rivets. Direct contact; a window is processed on the single-sided copper-clad laminate, and the window runs through the single-sided copper-clad laminate and the prepreg;

[0099] b. Ceramic substrate processing: the upper and lower surfaces of the ceramic substrate are respectively plated with a titanium layer by the first sputtering process, then the first copper layer is plated by the second sputtering process, and then the second copper layer is plated by the first electroplating process. The copper layer is finally cut into ceramic blocks, the size of the ceramic block matches the size of the window;

[0100] c. Pressing: Insert the cut ceramic block into the window, and then perform pressing, ...

Embodiment 2

[0116] Embodiment 2 provides a method for preparing a heat dissipation circuit board inlaid with ceramics, at least including the following steps:

[0117] a. Copper-clad laminate processing: place the prepreg between two single-sided copper-clad laminates and then fix them with rivets. Direct contact; a window is processed on the single-sided copper-clad laminate, and the window runs through the single-sided copper-clad laminate and the prepreg;

[0118] b. Ceramic substrate processing: the upper and lower surfaces of the ceramic substrate are respectively plated with a titanium layer by the first sputtering process, then the first copper layer is plated by the second sputtering process, and then the second copper layer is plated by the first electroplating process. The copper layer is finally cut into ceramic blocks, the size of the ceramic block matches the size of the window;

[0119] c. Pressing: Insert the cut ceramic block into the window, and then perform pressing, so...

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Abstract

The invention relates to the manufacturing field of a circuit board, and specifically relates to a heat dissipation circuit board embedded with ceramic and a preparation method of the circuit board. The preparation method of the heat dissipation circuit board embedded with ceramic at least comprises the following steps of a, processing of copper-clad plates: putting a prepreg between two one-sidedcopper-clad plates and then performing fixation by a rivet, and processing windows in the one-sided copper-clad plates; b, processing of a ceramic substrate: plating a titanium layer on the upper andlower surfaces of the ceramic substrate through a first sputtering process separately, then plating a first copper layer through a second sputtering process, next, plating a second copper layer by afirst electroplating process, and finally cutting into ceramic blocks, wherein the dimensions of the ceramic blocks are matched with those of the windows; and c, lamination: embedding the cut ceramicblocks into the widows and then performing lamination; d, hole drilling: processing conductive holes in the one-sided copper-clad plates; and e, copper plating: depositing a third copper layer in theconductive holes through a chemical copper plating way and then plating a fourth copper layer through a second electroplating process.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a heat dissipation circuit board inlaid with ceramics and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics integration technology, highly integrated circuit boards have become an inevitable trend, and the volume of electronic components and logic circuits on circuit boards has been greatly reduced. increase, leading to changes in the working environment of components to high pressure and high temperature. If you want to keep electronic components working stably for a long time, you must improve the heat dissipation capacity and high-voltage resistance of the circuit board to ensure its service life and accuracy. [0003] At present, the heat dissipation of LED printed circuit boards mainly adopts metal substrates or ceramic substrates. Among them, the metal substrate and the copper foil are laminated with insul...

Claims

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Application Information

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IPC IPC(8): H05K3/02H05K1/02C23C28/02C25D3/38
CPCC23C28/023C25D3/38H05K1/0203H05K3/022
Inventor 刘统发
Owner 江苏贺鸿电子有限公司
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