Power chip stacking and packaging structure
A packaging structure and power chip technology, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of large packaging structure size, difficult chip interconnection electrodes, poor heat dissipation performance, etc., to achieve Excellent heat dissipation performance, wide application range, size reduction effect
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[0067]Embodiment 1: The first chip 20 is a triode chip, and the second chip 40 is a diode chip; the two sides of the triode are respectively provided with the source 21 and the drain, and the diode chip is provided with anode and cathode 41, respectively; the first electrode For the source 21, the second electrode is the drain, the third electrode is the cathode 41, and the fourth electrode is an anode.
[0068]When the power chip stacking package structure is applied, in the circuit of the triode chip and the circuit board 80, the parallel diode chip, the cathode 41 of the diode chip, and the cathode 41 of the diode chip can be turned off through the diode chip.
[0069]In the present embodiment, the triode chip is used as the first chip 20. Thus, the source 21 is welded to the metal sheet 10, and when the metal sheet 10 can be directly welded to the upper circuit board 80, the source 21 and the circuit board 80 are connected. .
[0070]When the power chip stack package is applied, the sour...
Example Embodiment
[0071]Embodiment 2: The first chip 20 is a diode chip, and the second chip 40 is a triode chip; the two sides of the triode are respectively provided with the source 21 and the drain, and the diode chip is provided with anode and cathode 41, respectively; the first electrode For the anode, the second electrode is the cathode 41, the third electrode is the drain, the fourth electrode is the source 21.
[0072]The triode chip as described in the present invention may be, but is not limited to, a MOSFET chip; a triode chip is a switching device.
[0073]In an embodiment, the first chip 20 is a triode chip, the first electrode being the source 21, the second electrode being the drain; the first chip 20 further includes and the Gate 23 copied by the source 21;
[0074]The lead frame further includes a third tube pin 34 insulated from the island 31, the gate 23 electrically connected to the third tube foot 34 by a metal wire 62; or the power chip stacking package structure Including a conductive s...
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