Chip packaging structure with good heat radiation performance

A technology of chip packaging structure and heat dissipation performance, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems that affect chip stability and limited heat dissipation capacity, and achieve the effects of ensuring efficient operation, low cost, and simple process implementation

Inactive Publication Date: 2012-02-08
常熟市广大电器有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] In the existing chip packaging structure, the chip is mostly wrapped in the injection molding body, and the heat transfer is mainly through

Method used

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  • Chip packaging structure with good heat radiation performance
  • Chip packaging structure with good heat radiation performance
  • Chip packaging structure with good heat radiation performance

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Embodiment Construction

[0018] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0019] figure 1 It is a structural schematic diagram of a chip packaging structure with excellent heat dissipation performance according to an embodiment of the present invention; figure 2 It is a structural schematic diagram of a heat dissipation device in a chip packaging structure with excellent heat dissipation performance according to an embodiment of the present invention; the chip packaging structure mainly includes a substrate 1, a chip 2, a lead body 3, a sealant 4 and a heat dissipation device 5, and is characterized in that the The chip 2 is arranged above the substrate 1, and is completely inside the sealing body 4, and is electrical...

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Abstract

The invention discloses a chip packaging structure with a good heat radiation performance. The chip packaging structure mainly comprises a substrate, a chip, a pin body, sealing glue and a heat abstractor. The structure is characterized in that: the chip is arranged above the substrate and is completely located in the sealing glue; the chip is electrically connected with one end of the pin body through a lead and the other end of the pin body stretches out of the sealing glue to be connected with an externally-arranged circuit board; the heat abstractor is arranged above the chip, one end of the heat abstractor is contacted with the upper surface of the chip and the other end stretches out of the sealing glue to radiate heat. The invention discloses the chip packaging structure with the good heat radiation performance, and the heat abstractor which is internally arranged in the chip packaging structure can be used for effectively transferring and dissipating the heat energy released by the chip in the sealing glue so that the efficient operation of the chip is ensured; and meanwhile, the chip packaging structure provided by the invention is simple in process implementing and low in cost and is suitable for the production in batches.

Description

technical field [0001] The invention relates to a chip packaging structure, in particular to a chip packaging structure for effectively improving the heat dissipation performance of a chip, and belongs to the technical field of chip packaging. Background technique [0002] Chip packaging technology is a process technology that wraps the chip to avoid contact between the chip and the outside world and prevent damage to the chip from the outside world. Impurities and bad gases in the air, and even water vapor will corrode the precision circuits on the chip, resulting in a decrease in electrical performance. Different packaging technologies differ greatly in terms of manufacturing processes and processes, and packaging also plays a vital role in the performance of the memory chip itself. With the rapid development of optoelectronic and microelectronic manufacturing technology, electronic products are always developing in the direction of smaller, lighter and cheaper, so the pa...

Claims

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Application Information

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IPC IPC(8): H01L23/367
CPCH01L2224/48091H01L2224/48247H01L2924/00014
Inventor 徐子旸
Owner 常熟市广大电器有限公司
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