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Dustproof plug-in box with high heat dissipation performance

A technology with heat dissipation performance and dust prevention, applied in the electrical field, can solve the problems of inflexible configuration of radiator box, low heat dissipation efficiency, side layout, poor protection performance, etc., to avoid dust and foreign matter intrusion, simplify internal wiring of equipment, Ensuring the effect of protective performance

Active Publication Date: 2019-09-03
NARI TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Purpose of the invention: The purpose of the present invention is to provide a dust-proof sub-box with high-efficiency heat dissipation performance, which can solve the problems of poor protection performance, low heat dissipation efficiency and inflexible configuration of the radiator sub-box with side layout at present.

Method used

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  • Dustproof plug-in box with high heat dissipation performance
  • Dustproof plug-in box with high heat dissipation performance
  • Dustproof plug-in box with high heat dissipation performance

Examples

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Embodiment 19

[0040] The embodiment takes the 19-inch standard box structure as an example

[0041] Such as Figure 1-6 As shown, a dust-proof sub-box with high-efficiency heat dissipation performance aims to solve the problems of low protection and poor heat dissipation of the existing sub-boxes with upper and lower openings. The heat dissipation module 13 is used to cooperate with the independent air duct part 7 installed in the box. The solution is to isolate the main heat of the heat source and dissipate heat outside the subrack. Its installation and implementation process are as follows.

[0042] Attach the inner side of the plug-in panel 8 to the end face of the radiator module, align the holes and tighten 3 screws to fix them. Stick the adhesive side of the epoxy board 17 to the inner side of the heat dissipation module 13, cover the heat conduction pad 10 above the heat source chip 19, align the position of the heat conduction pad 10 with the square hole of the epoxy board 17, and ...

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Abstract

The invention discloses a dustproof plug-in box with a high heat dissipation performance, and belongs to the technical field of electricity. The dustproof plug-in box comprises an air duct component,wherein a heat dissipation module is plugged into the air duct component to form an independent air duct structure after matching; the air duct component is arranged in the dustproof plug-in box, andthe dustproof plug-in box comprises a box upper cover plate and a box lower cover plate which are connected through two oppositely arranged box side plates. According to the invention, the internal structure of the standard plug-in box is redesigned, and the air duct component and the heat dissipation module matched with the standard plug-in box are designed, so that the heat of the heat source chip is transferred to the heat dissipation module and dissipated outside the plug-in box through the air duct component, the invasion of dust and foreign matters caused by opening air holes is avoided,and the heat dissipation performance and the environmental adaptability of the plug-in box are enhanced; the number and the installation positions of the air duct components can be flexibly configured, the reasonable layout of the plug-in units is facilitated, the anti-interference capability of the circuit is improved, and the internal wiring of the device is optimized.

Description

technical field [0001] The invention belongs to the field of electrical technology, and in particular relates to a dust-proof plug-in box with high-efficiency heat dissipation performance. Background technique [0002] With the development and upgrading of smart substations and on-site devices, there have been requirements for the installation of plug-in boxes in outdoor cabinets and on-site installations, which put forward higher requirements for the IP protection level and heat dissipation performance of the devices. [0003] The existing heat dissipation method of ordinary subracks is likely to cause various problems such as lowering the protection level of the subrack, dust intrusion into the chassis, and failure of electronic components. Elevated installation requirements. [0004] When the existing 19-inch standard subracks are configured with high-power plug-ins, the upper and lower cover plates are usually opened to speed up the airflow exchange inside and outside t...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20536H05K7/20545
Inventor 夏雨郑立亮郑玉平周华良甘云华王小红高俊杰
Owner NARI TECH CO LTD
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