Flip chip plastic package structure with cooling structure and manufacturing method

A technology of flip-chip and heat dissipation structure, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of poor heat dissipation and high cost, and achieve good heat dissipation performance, low cost, Good cooling effect

Inactive Publication Date: 2014-12-24
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Embodiments of the present invention provide a flip-chip plastic packaging structure with a heat dissipation structure and a manufacturing method, which are used to solve the techn

Method used

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  • Flip chip plastic package structure with cooling structure and manufacturing method
  • Flip chip plastic package structure with cooling structure and manufacturing method
  • Flip chip plastic package structure with cooling structure and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] [Example One]

[0027] To enable those skilled in the art to understand the present invention in more detail, the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Such as figure 1 Said, figure 1 It is a flip-chip plastic packaging structure with a heat dissipation structure in an embodiment of the present invention, wherein the structure includes:

[0029] Chip 1

[0030] The substrate 2 is provided with the chip 1 on the first surface 21 of the substrate 2;

[0031] A height-limiting block 3, which is arranged on the first surface 21 of the substrate 2;

[0032] Specifically, the height-limiting block 3 may be a material such as metal, plastic, silicon, etc. The height-limiting block 3 is mainly used to support the heat dissipation plate 4, and the height-limiting block and the chip are set at the same height to ensure The heat dissipation plate 4 is parallel to the substrate 2. Further, both the height limiting block 3 a...

Example Embodiment

[0044] [Example 2]

[0045] Such as Figure 2-7 As shown, the embodiment of the present invention also provides a flip-chip plastic packaging manufacturing method with a heat sink, the method including:

[0046] Step 110: soldering the chip 1 to the first surface 21 of the substrate 2;

[0047] Specifically, step 110 may specifically include bonding the chip to the substrate by flip-chip bonding.

[0048] Step 120: Fill the undercoating material 7 at the bumps of the chip 1;

[0049] Step 130: Pasting a height-limiting block 3 on the first surface 21 of the substrate 2 so that the height-limiting block 3 is the same height as the chip 1;

[0050] Step 140: Fill the first surface 21 of the substrate 2 with a plastic molding resin 5, press the heat dissipation plate 4 on the surface of the plastic resin 5, and drain the air bubbles in the resin to cure;

[0051] Specifically, the plastic molding resin 5 is filled in the first space formed by the first surface 21 of the substrate 2, the hei...

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PUM

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Abstract

The invention discloses a flip chip plastic package structure with a cooling structure and a manufacturing method, and relates to the technical field of semiconductors. According to the flip chip plastic package structure with the cooling structure and the manufacturing method, a chip and height limiting blocks are arranged on the first face of a base plate, a cooling plate is arranged on the chip and the height limiting blocks, and a first space formed by the cooling plate, the chip, the height limiting blocks and the base plate is filled with plastic package resin. In other words, through the cooling plate on the height limiting blocks and the chip, the plastic package structure is manufactured without molds, and the flip chip plastic package structure with the cooling structure and the manufacturing method have the advantage that cost is low.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a flip-chip plastic packaging structure with a heat dissipation structure and a manufacturing method. Background technique [0002] In the field of semiconductor technology, the commonly used flip-chip plastic packaging structure and method are usually to flip-chip solder the chip on the substrate, then fill it with glue, and then perform plastic packaging through a mold, and then encapsulate the entire chip with resin. Bumping is done on the backside of the substrate to complete the entire packaging process. [0003] But, those skilled in the art find that there is following deficiency in the prior art through research: [0004] 1. Although this plastic packaging structure and method is simple and easy to mass-produce, it needs to make high-precision molds, and for different packaging heights, different molds need to be manufactured. Due to the high cost of mold manufact...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/367H01L21/56
CPCH01L2224/16227H01L2224/32225H01L2224/73204H01L2224/73253H01L2224/92125H01L2224/92225H01L2924/15311H01L2224/16225H01L2924/00
Inventor 于中尧郭学平
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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