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Transistor control circuit and power supply unit

A technology for controlling circuits and transistors, applied in the direction of transistors, circuits, high-efficiency power electronics conversion, etc., can solve the problem of insufficient reduction of source and drain on-resistance

Active Publication Date: 2016-05-25
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, when trying to operate GaN-HEMTs at higher frequencies and higher voltages, there is a problem that only providing field plates is not enough to reduce the on-resistance between source and drain

Method used

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  • Transistor control circuit and power supply unit
  • Transistor control circuit and power supply unit
  • Transistor control circuit and power supply unit

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Embodiment Construction

[0021] If a GaN-HEMT is operated at a high frequency and a high voltage, a current collapse phenomenon in which a drain current decreases occurs. One possible cause of the current collapse phenomenon is that free electrons are trapped in electron trap levels near the drain electrode side of the gate electrode. If electrons are trapped in surface trap levels, a depletion layer is formed in the 2DEG layer, increasing the resistance between source and drain, which can lead to a drop in the output of GaN-HEMTs. As a countermeasure against the current collapse phenomenon, there is a GaN-HEMT that includes a control electrode made of a metal plate (hereinafter referred to as a field plate) between the gate and drain in order to weaken the electric field near the gate electrode increase.

[0022] figure 1 is a cross-sectional view showing the structure of GaN-HEMT 30 including field plate 40 . An AlN layer 91 , an undoped i-GaN layer 92 , and an n-type n-AlGaN layer 94 are sequent...

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Abstract

The present application discloses a transistor control circuit and a power supply device. The transistor control circuit includes: a transistor including a gate electrode with a gate field plate, a drain electrode, and a layer formed between the gate field plate and the drain electrode. a control electrode on top of the inter-insulator film; a comparator circuit that compares the drain voltage of the transistor with a reference voltage; and an electrode control circuit that generates a voltage to be given to the control electrode based on a comparison result from the comparator circuit.

Description

technical field [0001] Embodiments discussed herein relate to high electron mobility transistor control circuits, as well as power supply devices. Background technique [0002] Recently, there has been active development of electronic devices (compound semiconductor devices) in which a gallium nitride (GaN) layer and an AlGaN layer are sequentially formed on a substrate made of a material such as sapphire, SiC, GaN or Si, and the GaN layer is used as an electron transit layer. [0003] The bandgap of GaN is 3.4eV, which is large compared with 1.1eV of Si and 1.4eV of GaAs. For this reason, such semiconductor compound devices are expected to operate at high voltages. [0004] One such compound semiconductor device is a GaN-based high electron mobility transistor (HEMT). Hereinafter, such GaN-based high electron mobility transistors will be referred to as GaN-HEMTs. A HEMT is a field-effect transistor that includes a high-mobility two-dimensional electron gas (2DEG) induce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/08
CPCH03K17/063H03K17/567H02M1/0054Y02B70/10
Inventor 今田忠纮
Owner FUJITSU LTD