Transistor control circuit and power supply unit
A technology for controlling circuits and transistors, applied in the direction of transistors, circuits, high-efficiency power electronics conversion, etc., can solve the problem of insufficient reduction of source and drain on-resistance
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[0021] If a GaN-HEMT is operated at a high frequency and a high voltage, a current collapse phenomenon in which a drain current decreases occurs. One possible cause of the current collapse phenomenon is that free electrons are trapped in electron trap levels near the drain electrode side of the gate electrode. If electrons are trapped in surface trap levels, a depletion layer is formed in the 2DEG layer, increasing the resistance between source and drain, which can lead to a drop in the output of GaN-HEMTs. As a countermeasure against the current collapse phenomenon, there is a GaN-HEMT that includes a control electrode made of a metal plate (hereinafter referred to as a field plate) between the gate and drain in order to weaken the electric field near the gate electrode increase.
[0022] figure 1 is a cross-sectional view showing the structure of GaN-HEMT 30 including field plate 40 . An AlN layer 91 , an undoped i-GaN layer 92 , and an n-type n-AlGaN layer 94 are sequent...
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