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Circuit board and manufacturing method thereof

A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problem that the circuit board cannot be connected

Inactive Publication Date: 2014-05-07
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the position deviation between the identification mark and the fingers exceeds the tolerance requirement, it will cause the fingers of the circuit board to be unable to effectively connect with the assembled components during the thermocompression soldering process

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Experimental program
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Effect test

Embodiment Construction

[0024] The circuit board provided by the technical solution and its manufacturing method will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0025] The first embodiment of the technical solution provides a method for manufacturing a circuit board, and the method for manufacturing a circuit board includes the following steps:

[0026] For the first step, please also refer to Figure 1 to Figure 3 , providing a first circuit substrate 110 and a second circuit substrate 120 .

[0027] In this embodiment, the first circuit substrate 110 includes a first insulating layer 111 , a first inner conductive circuit layer 112 and a first copper foil layer 113 . The first inner conductive circuit layer 112 and the first copper foil layer 113 are formed on two opposite surfaces of the first insulating layer 111 . The first circuit substrate 110 can be obtained by using a double-sided copper-clad substrate and etching a layer of copper...

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PUM

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Abstract

The invention provides a circuit board comprising a first external layer conductive line layer, a first insulating layer, a first internal layer conductive line layer, a connecting film, a second internal layer conductive line layer, a second insulating layer, a second external layer conductive line layer and an identification mark which are arranged in turn. A blind hole is formed in the circuit board and penetrates through the first external layer conductive line layer to the connecting film. The first external layer conductive line layer comprises multiple first fingers. The second external layer conductive line layer comprises multiple second fingers. The identification mark is corresponding to the blind hole. The first external layer conductive line layer, the second external layer conductive line layer and the identification mark are manufactured and formed simultaneously. The invention also provides a manufacturing method of the circuit board.

Description

technical field [0001] The invention relates to a circuit board manufacturing technology, in particular to a method for manufacturing a circuit board with golden fingers. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans . on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425. [0003] Circuit boards need to be assembled with other circuit boards or electronic components. Currently, flexible circuit board assembly methods include connector connection, anisotropic conductive adhesive connection, and finger (hot bar) thermocompression welding. Among them, hot bar hot-compression welding can meet the requirements of reducing the size of the assembly, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0269H05K1/0298H05K2201/0108H05K2201/09063H05K2201/09936Y10T156/1056H05K3/00
Inventor 左青罗斌钦
Owner AVARY HLDG (SHENZHEN) CO LTD