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Method for measuring circuit board lamination deflection

A technology for measuring circuits and circuit boards, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., to achieve the effect of saving production costs and reliable quality judgment basis

Inactive Publication Date: 2017-08-11
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although these positioning methods can improve the alignment accuracy of lamination, the problem of characterization of the actual alignment of laminated boards is also a topic of great concern to the industry.

Method used

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  • Method for measuring circuit board lamination deflection
  • Method for measuring circuit board lamination deflection
  • Method for measuring circuit board lamination deflection

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] A method for measuring the lamination deviation of a circuit board, comprising the following steps:

[0030] (1) Set the measurement target.

[0031] Set cross-shaped measurement targets at the four corners of each core board of the circuit board, such as figure 1 As shown, the four measurement targets are labeled A, B, C, and D respectively, wherein, the measurement targets A, B and the measurement targets D, C are symmetrical about the lateral centerline S of the circuit board, and the measurement targets A, D and the measurement target B , C is symmetrical about the vertical centerline L of the circuit board.

[0032] When the inner layer pattern is made, the measurement target is compensated according to the difference in the thickness of the bottom copper of each core board. For example, in this embodiment, if the line width of ...

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Abstract

The invention discloses a method for measuring laminated deflection of a circuit board, and belongs to the technical field of printed circuit board manufacture. The method includes the following steps of firstly, arranging a measurement target on each core plate of the circuit board; secondly, overlapping the measurement targets at the corresponding positions of the different core plates after laminating is conducted on the circuit board, and drilling a tapered through hole in the position, provided with the measurement targets, of the circuit board; thirdly, observing the tapered through hole from the end, with the larger opening, of the tapered through hole through a 3D microscope, and calculating the laminated deflection condition of the circuit board according to the relative positions, displayed in the tapered through hole, of the measurement targets on the different core plates. According to the method, the measurement targets are arranged on the core plates of the circuit board, the hole is drilled at the position, provided with the measurement targets, of the circuit board through a taper bit after laminating is conducted, then, the measurement targets of the different core plates are measured, and therefore the deflection condition between the layers of the circuit board can be accurately measured.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for measuring the lamination deviation of a circuit board. Background technique [0002] With the continuous development of PCB (Printed Circuit Board, printed circuit board) technology, its wiring density is increasing, the number of layers is increasing, and the structure is becoming more and more complicated (buried, blind, and through-hole structures coexist), making many The alignment accuracy between laminates is getting higher and higher. In the manufacturing process of multi-layer boards, the alignment accuracy is mainly affected by the lamination process, and the lamination process mainly uses rivets, hot-melt bonding, and PIN-LAM positioning methods to improve the alignment accuracy of the board. Although these positioning methods can improve the alignment accuracy of lamination, the problem of characterization of the actual alignment ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 袁处袁凯华曾志军
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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