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Micro alloying process

A micro-alloy and process technology, applied in the field of optoelectronics, can solve the problems of electrode loss and production cost waste, and achieve the effect of improving yield, increasing stability and reducing electrode loss.

Inactive Publication Date: 2014-05-21
毛华军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Micro-alloying technology is an essential process step in the LED production process. The quality of the micro-alloying process directly determines the reliability and firmness of the LED chip electrodes. However, due to some defects in the micro-alloying process, the micro-alloying post-batch Phenomena such as electrode drop occur, resulting in waste of production costs

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0010] The principles and features of the present invention are described below, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0011] A kind of microalloying process, is characterized in that, described process step is as follows:

[0012] (1) Turn on the alloy furnace, adjust the air pressure of the alloy furnace to 45-55psi, raise the temperature of the alloy furnace to 300°C, and stabilize for 10 minutes;

[0013] (2) Put the chip on the slide table, and load the slide table into the alloy furnace;

[0014] (3) The microalloying process is as follows: preheating for 1.5 minutes → constant temperature for 8 minutes → cooling at the furnace mouth for 2.5 minutes → cooling outside the furnace for 3 minutes;

[0015] (4) After the alloy is finished, exit the alloy furnace and take out the chip.

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Abstract

The invention relates to a micro alloying process which is characterized by including the following process steps: opening an alloying furnace, adjusting the pressure of the alloying furnace to be 45-55psi, enabling the temperature of the alloying furnace to increase to 300 DEG C, stabilizing the temperature for 10 minutes, placing a chip on a chip holder and arranging the chip holder into the alloying furnace. The micro alloy process includes conducting preheating for 1.5min, keeping the temperature for 8min, conducting furnace opening cooling for 2.5min and conducting furnace outside cooling for 3min. After alloying is finished, the chip holder is taken out from the alloying furnace, and the chip is taken out. The micro alloying process has the advantages of improving micro alloying stability by improving the micro alloying process, reducing electrode falling and improving product yield.

Description

technical field [0001] The invention relates to a microalloy process, which belongs to the field of optoelectronics. Background technique [0002] Micro-alloying technology is an essential process step in the LED production process. The quality of the micro-alloying process directly determines the reliability and firmness of the LED chip electrodes. However, due to some defects in the micro-alloying process, the micro-alloying post-batch Phenomena such as electrode drop occur, resulting in waste of production cost. Contents of the invention [0003] The invention provides a micro-alloy process aiming at the deficiencies in the prior art. [0004] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a microalloy process, characterized in that, the process steps are as follows: [0005] (1) Turn on the alloy furnace, adjust the air pressure of the alloy furnace to 45-55psi, raise the temperature of the alloy fur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00C23C10/00
CPCH01L33/36H01L21/02697
Inventor 毛华军
Owner 毛华军