Connection structure for LED (Light Emitting Diode) optical module and radiator
A connection structure and optical module technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems affecting the performance and service life of LED lights, large heat dissipation of LED lights, unreasonable heat dissipation structure, etc., and achieve low manufacturing cost , fast heat conduction and wide application range
Inactive Publication Date: 2014-05-21
深圳市晶联科技发展有限公司
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] As we all know, LED lights have a large heat dissipation. If the heat dissipation is not smooth, or the heat dissipation structure is unreasonable, it will seriously affect the performance and service life of LED lights.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0009] Such as figure 1 As shown, a connection structure between an LED optical module and a heat sink according to the present invention includes a heat conduction substrate 1 and an LED chip base 2, the heat conduction substrate 1 and the heat conduction column 12 are fixedly connected together by heat conduction screws 11, and the LED chip base 2 is processed with a through hole 21 whose diameter is larger than the outer diameter of the head of the heat conduction screw 11. The LED chip 22 is welded in the through hole 21 of the LED chip base 2. The surfaces fit together.
[0010] In the through hole 21 , a thermally conductive metal glue is coated between the bottom plane of the LED chip 22 and the head surface of the thermally conductive screw 11 .
[0011] The heat conducting substrate 1 and the LED chip base 2 are bonded together.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a connection structure for an LED (Light Emitting Diode) optical module and a radiator. The connection structure for the LED optical module and the radiator comprises a heat conduction substrate and an LED chip base; the heat conduction substrate and a heat conduction column are fixedly connected through a heat conduction bolt; a through hole is machined in the LED chip base; the bore diameter of the through hole is larger than the outer diameter of the head of the heat conduction bolt; an LED chip is welded in the through hole of the LED chip base; the bottom surface of the LED chip and the head surface of the heat conduction bolt are adhered; the heat conduction substrate and the LED chip base are adhered. The connection structure for the LED optical module and the radiator has the advantages of being quick in heat conduction, high in heat dissipation efficiency, low in manufacturing cost and wide in application range.
Description
technical field [0001] The invention relates to a connection structure, in particular to a connection structure between an LED optical module and a radiator. Background technique [0002] As we all know, LED lights have a large amount of heat dissipation. If the heat dissipation is not smooth, or the heat dissipation structure is unreasonable, it will seriously affect the performance and service life of LED lights. Contents of the invention [0003] The problem to be solved by the present invention is to overcome the deficiencies in the background technology and provide a connection structure between the LED optical module and the heat sink. This heat dissipation structure ensures that the heat of the LED chip is transmitted out in time. The structure conducts heat quickly and has high heat dissipation efficiency. , low manufacturing cost. [0004] In order to solve the above problems, the present invention takes the following technical solutions: [0005] The connection...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/644H01L33/64
Inventor 顾仁法
Owner 深圳市晶联科技发展有限公司