Inspection method and inspection fixture for scribing lines of wafer

Abstract

An inspection method and an inspection fixture for the scribing lines of a wafer are disclosed. The inspection method includes the following steps: providing a wafer having multiple chips and a lower surface attached with a dicing tape, wherein scribing lines are formed between the chips; connecting the dicing tape with a transparent carrier supporting a first liquid medium such that the dicing tape is contacted seamlessly with the first liquid medium, wherein the difference of refractive index between the first liquid medium and the dicing tape is less than 0.3; and inspecting the scribing lines through the transparent carrier from below the lower surface of the wafer by an inspection lens of an optical inspector. The inspection method and fixture increase the image resolution of the scribing lines so as to facilitate the detection of lower-surface defects of the scribing lines.

Description

technical field [0001] The invention relates to a wafer detection method and its detection jig, in particular to a wafer dicing line detection method and its detection jig. Background technique [0002] figure 1 It is a schematic diagram of a known wafer to be inspected. Such as figure 1 As shown, in the integrated circuit package manufacturing process, the wafer dicing film (Dicing Tape) 20 is first pasted on the back of the processed wafer 10 to be inspected, and then the step of cutting the wafer 10 to be inspected is called wafer dicing ( Wafer Dicing). [0003] If the die 11 is damaged during the wafer dicing process, and if the damaged die 11 is not detected immediately and used in the subsequent manufacturing process, defective finished products will be produced. Therefore, if the defective crystal grains 11 are not detected, a lot of precious time and materials will be wasted in the subsequent manufacturing process. If the wafer 10 to be inspected can be inspect...

AI Technical Summary

Problems solved by technology

However, because the surface of the wafer cutting film 20 is not an ideal smooth optical surface, the polarization capability of the surface interface of the wafer cutting film 20 affects the polarization scattering energy distribution of the light on the surface of the medium, so that the light is scattered due to scattering. The direction of energy distribution changes at the refraction interface, so that the light is distributed along the light path L', and finally the obtained detection image is distorted and cannot be used to judge whether there is a crack on the lower surface112

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