Stereo led illuminant and its processing method

A luminous body and three-dimensional technology, which is applied in the direction of semiconductor devices, electric solid devices, electrical components, etc., can solve the problems affecting the quality of the lamp body, the lead wires are not easy to fix, and the welding connection is difficult, so as to reduce the difficulty of production operation and facilitate production operation and fixation , Precise and stable positioning effect

Inactive Publication Date: 2017-07-14
东莞市昱鸿光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The lead wire is used as its own stress support and fixed to the lamp holder in the bulb body. Since the transparent substrate of the light-emitting part has a width of about 1 mm and a thickness of about 0.5 mm, the lead wires are nano-scale gold wires. In production, it is difficult to weld and connect because the lead wire is not easy to fix. At the same time, there are defects that are easy to fall off and disconnect after welding, which affects the quality of the lamp body.

Method used

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  • Stereo led illuminant and its processing method
  • Stereo led illuminant and its processing method
  • Stereo led illuminant and its processing method

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Embodiment Construction

[0044] like Figure 1 to Figure 7 As shown: a three-dimensional LED illuminant, including a strip-shaped transparent substrate 1 and several LED chips 2 connected in series. The two ends of 1 are respectively provided with metal connectors 3, and the metal connectors 3 are provided with U-shaped bayonets 31, which are buckled on both ends of the transparent substrate 1, and the metal connectors 3 and the transparent substrate 1 are fixed with glue. , the lead wire 21 is electrically connected to the metal connector 3 .

[0045] like Figure 7 As shown, metal terminals 11 are printed on both ends of the transparent substrate 1 , and the U-shaped metal connector 3 is buckled on the metal terminals 11 .

[0046] The lead wire 21 is welded to the metal connector 3 .

[0047] The lead wire 21 is welded to its opposite metal terminal 11 and sandwiched between the metal connector 3 and the metal terminal 11 .

[0048] The glue is a conductive glue.

[0049] The substrate of the ...

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Abstract

A three-dimensional LED illuminant and its processing method according to the present invention, the three-dimensional LED luminous body comprises a strip-shaped transparent substrate and several LED chips connected in series, the LED chip is positioned on the transparent substrate through transparent silica gel, and leads are provided at both ends, Wherein: the two ends of the transparent substrate are respectively provided with metal connectors, and the metal connectors are provided with U-shaped bayonets, which are buckled on both ends of the transparent substrate, and the metal connectors and the transparent substrate are fixed with glue, The leads are electrically connected to the metal connectors. The invention aims to provide a three-dimensional LED illuminant with simple structure and stable connection, and a processing method of the three-dimensional LED illuminant.

Description

technical field [0001] The invention relates to an LED light source, more specifically, to a three-dimensional LED light source and a processing method thereof. Background technique [0002] With the advancement of electronic technology, the use of LED lighting fixtures is becoming more and more common. LEDs use the luminous properties of semiconductors to emit light. Because LEDs are a green and environmentally friendly light source with long life, low power, and no radiation, they are widely used. Used in backlight, display, traffic lights, urban lighting and other fields. In the future, it will replace incandescent lamps and energy-saving lamps for lighting applications and become a new generation of lighting sources, widely used in indoor and outdoor general lighting and special lighting. [0003] The heat dissipated by traditional light-emitting diodes relies on the circuit substrate to conduct to the aluminum metal lamp holder and contact with the outside air to condu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/62H01L33/64
CPCH01L2924/181H01L2224/48091H01L2224/48137H01L2224/73265H01L2924/00014H01L2924/00012
Inventor 欧南杰
Owner 东莞市昱鸿光电有限公司
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