Vegetable seedling substrate and preparation method thereof
A technology of vegetable seedling raising substrate and edible fungus, applied in the field of vegetable seedling raising substrate and its preparation, can solve the problems of low utilization rate, waste of resources, environmental pollution, etc., and achieve the effects of improving seedling quality, reducing pollution, and improving seedling raising effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0046] Embodiment one: a kind of vegetable seedling-raising substrate, raw material component is made up of the material of following volume content:
[0047] Edible mushroom residue 30 parts
[0048] 10 servings of poultry manure
[0049] 60 pieces of cassava residue
[0050] The vegetable seedling-raising substrate is a decomposed product obtained by mixing the edible fungus residue, livestock and poultry manure and cassava residue and performing aerobic composting fermentation;
[0051] Wherein, the edible fungus residue is the culture medium waste left after harvesting edible fungus products during the cultivation process of edible fungi, and the particle size of the edible fungus residue is 1-5mm;
[0052] The livestock and poultry manure is chicken manure or duck manure or pig manure or cow manure or a mixture of any two of them or a mixture of any three or four of them;
[0053] The cassava residue is the waste left after the cassava is used as raw material to produce ...
Embodiment 2
[0059] Embodiment two: a kind of vegetable seedling raising substrate, raw material component is made up of edible fungus slag, livestock and poultry manure, tapioca slag and perlite;
[0060] The edible fungus dregs, livestock and poultry manure and cassava dregs are mixed first, and then aerobic composting fermentation is carried out to obtain decomposed products. The volume content of each material is:
[0061] Edible mushroom residue 30 parts
[0062] 10 servings of poultry manure
[0063] 60 pieces of cassava residue
[0064] Wherein, the edible fungus residue is the culture medium waste left after harvesting edible fungus products during the cultivation process of edible fungi, and the particle size of the edible fungus residue is 1-5mm;
[0065] The livestock and poultry manure is chicken manure or duck manure or pig manure or cow manure or a mixture of any two of them or a mixture of any three or four of them;
[0066] The cassava residue is the waste left after sta...
Embodiment 3
[0074] Embodiment 3: A substrate for growing vegetable seedlings. The raw material components and the preparation method thereof are similar to those in Embodiment 2, but the volume ratios of decomposed matter and perlite are: 75 parts of decomposed matter and 25 parts of perlite.
[0075] Use embodiment one, two and three, carry out seedling cultivation production the same as the peat substrate of conventional seedling cultivation, with this the seedling cultivation substrate of embodiment is checked, following is the test record of inspection process control and effect:
[0076] 1. Test material
[0077] Substrate raw materials for testing: the seedling-raising substrate containing decomposed agricultural waste, prepared by the inventor of the present application; peat is a product imported from Germany, with a pH of 5.8, containing 262.2g / Kg of organic matter, 1.25mg / Kg of alkaline nitrogen, and P 2 o 5 84.2μg / Kg, available potassium 14.2μg / Kg. Perlite is a product of Ji...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com