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Electronic equipment

A technology of electronic equipment and shooting equipment, which is applied in the electronic field, can solve the problem of high heat generation, and achieve the effect of small overall volume, compact structure and miniaturized design

Active Publication Date: 2016-12-28
SICHUAN AEE AVIATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Miniaturization and high frequency have become the development trend of most electronic equipment. In the existing electronic equipment, a large number of power devices are often used in order to improve performance. Due to the high heat generation of power devices, a large space is required for heat dissipation. , which makes heat dissipation and volume an irreconcilable contradiction

Method used

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Embodiment Construction

[0029] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention. At the same time, if there is no conflict between the technical features described here, they can be Combine with each other.

[0030] The present invention proposes an electronic device such as figure 1 and figure 2 , the electronic device includes a main support 1 for heat dissipation, a first PCB2, a second PCB3 and a first power device 4 arranged on the second PCB3. Wherein, the main bracket 1 includes a body 101 on which the first PCB2 and the second PCB3 are installed, and the first PCB2 and the second PCB3 are fixed on the body 101 of the main bracket 1 and are respectively located on two opposite sides of the body 101, so as to figure 1 As a...

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Abstract

The invention discloses electronic equipment which comprises a first PCB, a second PCB with a first power device, and a main support for heat dissipation. The main support comprises a body for installing the first PCB and the second PCB. The first PCB and the second PCB are both fixed on the body and located on the two opposite sides of the body respectively. The main support is used for fixing the first PCB and the second PCB, so that a front shell and a rear shell of the electronic equipment are lightened and thinned, a space cubic structure is defined by reasonably arranging all components, and therefore the electronic equipment is compact in structure and small in overall size, and miniaturization design is achieved. In addition, the main support can conduct out heat generated by all components, especially the heat generated by the first power device, and it is guaranteed that the electronic equipment can normally work.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device. Background technique [0002] With the development of electronic technology, various electronic devices, such as mobile phones, cameras, video cameras, tablet computers, etc., have occupied every aspect of people's lives. Miniaturization and high frequency have become the development trend of most electronic equipment. In the existing electronic equipment, a large number of power devices are often used in order to improve performance. Due to the high heat generation of power devices, a large space is required for heat dissipation. , which makes heat dissipation and volume an irreconcilable contradiction. Contents of the invention [0003] The main purpose of the present invention is to provide an electronic device, which not only improves the heat dissipation effect of the electronic device, but also reduces the overall volume of the electronic device...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/14H05K7/20
Inventor 张显志
Owner SICHUAN AEE AVIATION TECH CO LTD