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Method of making flexible circuit board and flexible circuit board

A technology of a flexible circuit board and a manufacturing method, which is applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problem of high manufacturing cost of flexible circuit boards and achieve the effect of reducing manufacturing costs.

Active Publication Date: 2014-07-09
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a method for manufacturing a flexible circuit board and a flexible circuit board, so as to overcome the disadvantages of the flexible circuit board caused by increasing the thickness or the number of layers of the flexible circuit board in order to increase the impedance value of the flexible circuit board in the prior art. The problem of high production cost

Method used

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  • Method of making flexible circuit board and flexible circuit board
  • Method of making flexible circuit board and flexible circuit board
  • Method of making flexible circuit board and flexible circuit board

Examples

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Embodiment 1

[0040] figure 1 It is a flow chart of the flexible circuit board manufacturing method disclosed in the embodiment of the present invention, the method is applied to the flexible circuit board including the reference ground and the signal layer, see figure 1 As shown, the manufacturing method of the flexible circuit board may include:

[0041] Step 101: Divide the conductor lines on the signal layer into a plurality of decomposed conductor lines with preset lengths in the extending direction of the conductor lines.

[0042] In this embodiment, the number of conductor wires can be one or more, and the number can be set according to customer requirements. The conductor wire can be made of copper or other signal transmission materials. The flexible circuit board includes a reference ground and a signal layer, and there may be multiple signal layers. The conductor line in the method disclosed in the embodiment of the present invention refers to the conductor line on the signal la...

Embodiment 2

[0065] Figure 4a It is a top view of the flexible circuit board disclosed by the embodiment of the present invention, Figure 4b It is a bottom view of the flexible circuit board disclosed in the embodiment of the present invention, Figure 4c For the side view of the flexible circuit board disclosed by the embodiment of the present invention, see Figure 4a and Figure 4b , in this embodiment, the flexible circuit board includes a reference ground 1 and a signal layer, and conductor lines 2 are laid on the signal layer, and there may be multiple signal layers. For ease of understanding, Figure 4a and Figure 4b Take only one signal layer as an example; similarly, there may be one or more conductor lines on the signal layer of the flexible circuit board. For ease of understanding, Figure 4a and Figure 4b Take two conductor wires 2 as an example.

[0066] Wherein, the conductor wire 2 is a conductor wire 2 that is divided into a plurality of decomposed conductor wires...

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Abstract

The invention discloses a method of making a flexible circuit board and a flexible circuit board. The method comprises first dividing a conductor line into a plurality of disassembled conductor lines of a preset length; second, obtaining an effective relative area of the conductor line to a reference area according to a target impedance value, target width and target thickness; and third, conducting local window opening processing for corresponding reference areas to all the disassembled conductor lines according to the proportion of the effective relative area and an actual relative area of the conductor line to the reference area. According to the embodiment of the invention, the capacitive property of a signal in the conductor line for the reference area is adjusted by change of the relative area of the conductor line to the reference area, and therefore the impedance value of the flexible circuit board is changed. The method can meet customer requirements for impedance values without increasing the thickness or the number of layers of the flexible circuit board and greatly reduce the cost for making the flexible circuit board.

Description

technical field [0001] The present invention relates to the field of flexible circuit boards, and more specifically, relates to a method for manufacturing a flexible circuit board and the flexible circuit board. Background technique [0002] Flexible circuit boards are printed circuits made of flexible insulating substrates, which have many advantages that rigid printed circuit boards do not have. Flexible circuit boards can be bent, wound, and folded freely, and can be arranged arbitrarily according to the requirements of spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection, so it has been widely used in the electrical field. application. [0003] Impedance is an important parameter of flexible circuit boards. Therefore, in order to meet the requirements of different applications, it is necessary to control the impedance value within a certain reasonable range when ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
Inventor 万斌
Owner LENOVO (BEIJING) LTD