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A kind of manufacturing method of flexible circuit board and flexible circuit board

A technology of flexible circuit boards and production methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of high production costs of flexible circuit boards, and achieve the effect of reducing production costs

Active Publication Date: 2018-01-23
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a method for manufacturing a flexible circuit board and a flexible circuit board, so as to overcome the disadvantages of the flexible circuit board caused by increasing the thickness or the number of layers of the flexible circuit board in order to increase the impedance value of the flexible circuit board in the prior art. The problem of high production cost

Method used

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  • A kind of manufacturing method of flexible circuit board and flexible circuit board
  • A kind of manufacturing method of flexible circuit board and flexible circuit board
  • A kind of manufacturing method of flexible circuit board and flexible circuit board

Examples

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Embodiment 1

[0040] figure 1 It is a flow chart of a method for manufacturing a flexible circuit board disclosed in an embodiment of the present invention, the method is applied to a flexible circuit board including a reference ground and a signal layer, see figure 1 As shown, the manufacturing method of the flexible circuit board may include:

[0041] Step 101: Divide the conductor lines on the signal layer into a plurality of decomposed conductor lines with preset lengths in the extending direction of the conductor lines.

[0042] In this embodiment, the number of conductor wires can be one or more, and the number can be set according to customer requirements. The conductor wire can be made of copper or other signal transmission materials. The flexible circuit board includes a reference ground and a signal layer, and there may be multiple signal layers. The conductor line in the method disclosed in the embodiment of the present invention refers to the conductor line on the signal layer...

Embodiment 2

[0065] Figure 4a It is a top view of the flexible circuit board disclosed by the embodiment of the present invention, Figure 4b It is a bottom view of the flexible circuit board disclosed in the embodiment of the present invention, Figure 4c For the side view of the flexible circuit board disclosed by the embodiment of the present invention, see Figure 4a and Figure 4b , in this embodiment, the flexible circuit board includes a reference ground 1 and a signal layer, and conductor lines 2 are laid on the signal layer, and there may be multiple signal layers. For ease of understanding, Figure 4a and Figure 4b Take only one signal layer as an example; similarly, there may be one or more conductor lines on the signal layer of the flexible circuit board. For ease of understanding, Figure 4a and Figure 4b Take two conductor wires 2 as an example.

[0066] Wherein, the conductor wire 2 is a conductor wire 2 that is divided into a plurality of decomposed conductor wires...

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Abstract

The invention discloses a method for manufacturing a flexible circuit board and the flexible circuit board. The method firstly divides the conductor wire into a plurality of decomposed conductor wires with preset lengths, and then obtains according to the target impedance value, target line width and target thickness. The effective relative area of ​​the conductor line and the reference ground, and according to the proportional relationship between the effective relative area and the actual relative area of ​​the conductor line and the reference ground, make a reference ground corresponding to all decomposed conductor lines Partial window treatment. The manufacturing method of the flexible circuit board and the flexible circuit board disclosed in the embodiments of the present invention adjust the capacitance of the signal in the conductor line to the reference ground by changing the relative area of ​​the conductor line and the reference ground, and then change the capacitance of the flexible circuit board. Impedance value, this method can meet the customer's requirements for impedance value without increasing the thickness or the number of layers of the flexible circuit board, greatly reducing the production cost of the flexible circuit board.

Description

technical field [0001] The present invention relates to the field of flexible circuit boards, and more specifically, relates to a method for manufacturing a flexible circuit board and the flexible circuit board. Background technique [0002] Flexible circuit boards are printed circuits made of flexible insulating substrates, which have many advantages that rigid printed circuit boards do not have. Flexible circuit boards can be bent, wound, and folded freely, and can be arranged arbitrarily according to the requirements of spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection, so it has been widely used in the electrical field. application. [0003] Impedance is an important parameter of flexible circuit boards. Therefore, in order to meet the requirements of different applications, it is necessary to control the impedance value within a certain reasonable range when ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/02
Inventor 万斌
Owner LENOVO (BEIJING) LTD