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Welding process and circuit board

A welding process and circuit board technology, applied in the direction of assembling printed circuits with electrical components, can solve the problems of small welding points and virtual welding of materials, and achieve the effect of changing the thickness of solder paste and adapting to the welding environment.

Inactive Publication Date: 2014-07-09
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing solder paste brushing process, there are often situations where the solder joints of the parts are small and lead to virtual soldering

Method used

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  • Welding process and circuit board
  • Welding process and circuit board
  • Welding process and circuit board

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0022] The embodiment of the invention discloses a welding process and a circuit board, so as to realize the technical effect of reliable welding when welding materials.

[0023] Solder paste is a kind of paste. After brushing the solder paste, the amount of solder paste on the circuit board depends on the size of the mesh hole of the stencil that leaks the solder paste, and the pad corresponding to the material on the circuit board (provided area of ​​the copper f...

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Abstract

An embodiment of the invention discloses a welding process and a circuit board. In the welding process, a steel net is placed above the circuit board, a mesh for the steel net to drip soldering tin corresponds to a material solder pad on the circuit board, and the steel net is provided with the mesh with a different size from that of the solder pad; the soldering tin is dripped out of the mesh of the steel net and deposited on the material solder pad; and the steel net is removed, and the circuit board is cooled after being subjected to high temperature. According to the embodiment of the invention, the height of the solder paste is elevated by use of the gathering property of the solder paste at a high temperature, or the height of the solder paste is lowered due to less dripped solder paste; and thus, a partial change in the thickness of the solder paste is achieved, and a more suitable soldering environment is provided for materials.

Description

technical field [0001] The invention relates to the technical field of welding technology, and more specifically, relates to a welding technology and a circuit board. Background technique [0002] Soldering is an essential process step in the production of circuit boards. [0003] When the existing circuit board is soldering the parts, it is necessary to carry out the process of brushing the solder paste on the whole board, and place the parts in alignment on the board surface after the solder paste has been brushed. The brushed solder paste has a certain thickness, which is basically the same as the thickness of the stencil of the solder paste. [0004] However, in the existing solder paste brushing process, there are often situations where the solder joints of the material parts are small and lead to false soldering. Contents of the invention [0005] In view of this, the present invention provides a welding process and a circuit board to achieve the technical effect o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 余秀青
Owner LENOVO (BEIJING) LTD