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Electroplating device of electrode for electrophysiological experiments

An electroplating device and experimental technology, which is applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problems that cannot meet the needs of electrophysiological experiments, the effect is not very ideal, and the operation is cumbersome, so as to achieve portable electroplating applications and save experimental time. and cost, and the effect of improving experimental efficiency

Inactive Publication Date: 2014-08-20
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional method is not only cumbersome to operate, pollutes the environment, and wastes materials, but also the effect is not very ideal: due to the unstable current, the electrode coating is uneven and easy to fall off; due to the uncontrollable time, the electrode thickness of each plating is not uniform, which interferes with the experiment
Another obvious disadvantage of the traditional electroplating method is that only one silver wire can be electroplated at a time, which is inefficient and far from meeting the needs of electrophysiological experiments.

Method used

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  • Electroplating device of electrode for electrophysiological experiments
  • Electroplating device of electrode for electrophysiological experiments
  • Electroplating device of electrode for electrophysiological experiments

Examples

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Effect test

Embodiment 1

[0021] In this example, see Figure 4 and Figure 5 , an electroplating device for electrodes used in electrophysiological experiments, including a power supply 1 and an electroplating solution container, the power supply 1 is composed of six 1.5V dry batteries to form a dry battery pack, the positive and negative poles of the power supply are respectively connected to the electroplating anode electrode and the cathode electrode, and the electroplating The anode electrode and the cathode electrode are immersed in the electroplating solution in the electroplating solution container at the same time. The electroplating reactor includes at least one electroplating working room 4. The electroplating working room 4 is composed of a closed U-shaped tube, and one end of the U-shaped tube is connected with a short metal thin tube. , the silver wire to be electroplated can be electroplated only by passing through the central hole of the thin metal tube and immersed in the electroplatin...

Embodiment 2

[0025] This embodiment is basically the same as Embodiment 1, especially in that:

[0026] In this example, see Figure 6 , the single-chip microcomputer is also provided with a spare terminal for externally connecting the high-flux electroplating tank 5, the electroplating reactor also includes the high-flux electroplating tank 5, the high-flux electroplating tank 5 is formed by at least 4 groups of electroplating tanks connected in series, through Control the transfer switch to make the electroplating work state switch between single-electrode electroplating and multi-electrode electroplating. The electroplating device for electrodes used in electrophysiological experiments in this example consists of five parts: power supply 1, control module 2, electroplating liquid level detector 3, electroplating studio 4 and high-throughput electroplating tank 5, forming a new dual-purpose electrophysiological and electroplating integrated machine. The combination of external electropl...

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Abstract

The invention discloses an electroplating device of an electrode for electrophysiological experiments. An electroplating reactor contains at least an electroplating operating room which is composed of a sealed U-shaped tube. A silver filament to be electroplated passes through a central hole of a metal thin tube at one end of the U-shaped tube and then is immersed into an electroplate liquid to form an electroplating anode electrode. The other end of the U-shaped tube is provided with an electroplating cathode electrode and an opening and closing cover opening. A power supply controls the electroplating process through a control module which is composed of a circuit for keeping current constant and a circuit with a timing function. The electroplating operating room is also equipped with an electroplate-liquid level detector for liquid level of the electroplate liquid. By the adoption of a control circuit, current is controlled to be stable and electroplating time is controlled to be constant; it is ensured that thickness of silver chloride covering the surface of the silver filament electroplated each time is uniform and unified; and uncontrollable factors in an experiment are minimized. In addition, multiple electroplating tanks are also externally connected. Thus, high-flux electroplating is realized; multiple silver filaments can be electroplated at a time; and electroplating is more convenient, rapid and efficient.

Description

technical field [0001] The invention relates to an electroplating machine, in particular to an electroplating machine for electrode electroplating, which is applied in the technical field of electrophysiological experiment electrode coating preparation. Background technique [0002] Electrophysiological technology is a technical means to stimulate organisms with various forms of energy such as electricity and sound, and measure the power generation of organisms to study the electrical characteristics of organisms. Electrophysiological technique is one of the most commonly used techniques in neuroscience, mainly including patch clamp technique and two-electrode voltage clamp technique, both of which frequently use a thin silver wire coated with a layer of silver chloride as the Recording electrode and reference electrode. Electrodes must be prepared before each electrophysiological experiment, and sometimes electrodes need to be re-plated because the electrode coating falls ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D21/12C25D17/00
Inventor 吉永华张恒周邮刘志睿刘书朋
Owner SHANGHAI UNIV
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