Package for housing electronic components and electronic device

A technology of electronic components and packages, which is applied in the direction of circuit devices, printed circuit components, printed circuits connected with non-printed electrical components, etc., and can solve problems such as signal phase difference

Active Publication Date: 2016-11-16
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, due to the difference in the length of the signal lines, there will be a phase difference in the signal transmitted in each signal line

Method used

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  • Package for housing electronic components and electronic device
  • Package for housing electronic components and electronic device
  • Package for housing electronic components and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Hereinafter, the electronic component housing package 1 (it will only be called a package 1 hereafter) and the electronic device 101 provided with it in each embodiment of this invention are demonstrated in detail using drawings. However, each drawing referred to below is a structure shown more simplified than actual in order to explain this invention. Therefore, the package and the electronic device according to the present invention can include arbitrary components not shown in the drawings referred to in this specification. In addition, the scale of each figure differs from an actual one.

[0027] exist Figure 1 ~ Figure 5B The package of the first embodiment is shown. The package 1 of the first embodiment includes a container main body composed of a substrate 3 and a frame 5 . The substrate 3 has a dielectric region 3a made of a dielectric, and a mounting region 3b for electronic components adjacent thereto. In the mounting area 3b, the electronic component 103...

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Abstract

Many wiring conductors are required to be provided in packages for mounting electronic components, but a phase difference in signals due to differences in signal transmission distances of the wiring conductors is a problem. An electronic component housing package according to one aspect of the present invention includes: a substrate having a dielectric region and an electronic component mounting region; a frame provided to surround the dielectric region and the mounting region; and a dielectric region arranged on the substrate multiple wiring conductors. The plurality of wiring conductors includes a first wiring conductor arranged in the dielectric region from directly below the housing, and a second wiring conductor whose signal transmission distance is longer than that of the first wiring conductor. In addition, the housing made of a dielectric has a protruding portion that protrudes from the inner peripheral surface and covers at least a part of the first wiring conductor.

Description

technical field [0001] The present invention relates to an electronic component housing package and an electronic device that accommodate electronic components such as semiconductor elements. Such electronic devices are used in various electronic equipment. Background technique [0002] As an electronic component housing package (hereinafter also simply referred to as a package) that accommodates an electronic component, there is, for example, a package in which a plurality of signal lines are radially formed on the upper surface of a dielectric substrate. The signal line is connected to the electronic component mounted on the dielectric substrate via a plurality of pads. [0003] Prior art literature [0004] patent documents [0005] Patent Document 1: JP Unexamined Patent Publication No. 9-275145 [0006] Summary of the invention [0007] The problem to be solved by the invention [0008] However, since the plurality of signal lines are arranged radially, the length...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L23/04
CPCH01L23/057H01L2224/48091H01L2924/3011H01L23/49861H05K1/024H05K2201/09336H01L2924/00014H01L2924/00H05K1/0213H05K1/18
Inventor辻野真广川头芳规
OwnerKYOCERA CORP