Method for detecting heat dissipating property of metal heat dissipation device and testing device thereof

Abstract

The invention discloses a method for detecting the heat dissipating property of a metal heat dissipation device and a testing device thereof. The method is characterized in that a detected heat dissipation device is arranged in a cavity, a heated end of the detected heat dissipation device is attached with a steady temperature-controllable heat source to raise the temperature of the heat dissipation device, an airflow cooling heat-dissipating device with controllable temperature and adjustable flow rate is arranged at the heat dissipation part of the heat dissipation device, and the temperature of airflows flowing through the heat dissipation device and heated by the heat dissipation device is recorded; when the heat dissipation device is heated and cooled stably, the temperature of the stably heated airflows represents the comprehensive heat dissipation property of the heat dissipation device, that is, the higher the stable temperature of the heated air flows is, the better of the comprehensive heat dissipation property of the heat dissipation device is under the constant heat source with the same temperature and the same cooling condition, therefore, the comprehensive heat dissipation property of the heat dissipation device is represented and estimated; according to the method, the complex heat dissipating process and the contribution of the physical property parameters of the heat dissipating metal and the structural characteristics of the heat dissipation device to the heat dissipating property of the heat dissipation device are comprehensively considered.

Description

technical field [0001] The invention relates to a method and device for evaluating and testing the heat dissipation performance of a material, in particular to a method and a device for testing the heat dissipation performance of a metal heat dissipation material, which are applied in the technical field of device heat dissipation. Background technique [0002] At present, with the rapid development of electronic products, the rapid popularization of LED display technology and the continuous increase of the power of various integrated chips, the problem of heat dissipation has become an important problem, and it has become a bottleneck that is difficult to break through in the development of electronic products. At this stage, the testing of heat dissipation components is still not perfect. At present, the research at home and abroad mainly focuses on the measurement of material thermal conductivity and thermal diffusivity, but the comprehensive thermal performance test platf...

AI Technical Summary

Problems solved by technology

However, for laboratories, research and development departments, and testing departments, there is no method and device that can be used to detect and evaluate the comprehensive heat dissipation performance of various heat dissipation devices, metals, or finished products of heat dissipation devices used in electronic products.

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