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Bonding device and film substrate holding unit

A bonding device and substrate holding technology, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as long-term stoppage of bonding devices

Active Publication Date: 2018-03-09
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the entire crimping head must be replaced every time the shape of the film-like substrate is changed
In addition, the replacement work of the crimping head requires multiple steps such as adjusting the parallelism and adjusting the position of the suction part, and there is a problem that the operation of the bonding device must be stopped for a long time.

Method used

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  • Bonding device and film substrate holding unit
  • Bonding device and film substrate holding unit
  • Bonding device and film substrate holding unit

Examples

Experimental program
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Effect test

Embodiment Construction

[0046] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 The shown bonding device 1 is a device for crimping an external connection terminal group 3a formed on an edge portion of a film substrate 3 to a film substrate crimped portion 2a provided at an end of a substrate 2, and includes: a substrate Holder 11, which holds the substrate 2; Relay stand 12, which is arranged in the front and rear direction of the substrate holder 11 ( figure 1 The left and right direction of the paper. The film-shaped substrate 3 supplied from the film-shaped substrate supply unit (not shown) is temporarily placed behind the film-shaped substrate 3 before it is pressure-bonded to the substrate 2; the pressure head 13 moves in the direction of the horizontal plane. Freely arranged on the upper area of ​​the substrate holding table 11 and the relay table 12, the film-like substrate 3 placed on the relay table 12 is adsorbed and crimped on t...

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PUM

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Abstract

The present invention provides a bonding device that can easily and quickly respond to changes in the shape of a film-like substrate that is an object to be pressed onto the substrate. The bonding device of the present invention is provided with a crimping joint (13), which is provided with a crimping tool (23) for crimping the external connection terminal group (3a) of the film-like substrate (3) on the substrate (2), and a crimping tool (23) for crimping the external connection terminal group (3a) of the film-like substrate (3). A crimping tool lifting mechanism (22) that raises and lowers the tool (23); a film-like substrate holding unit (26) that holds the film-like substrate in a state where the external connection terminal group (3a) is located below the crimping tool (23) (3). The film-form substrate holding unit (26) includes a plurality of adsorption portions (54, 65) arranged at positions corresponding to the shape of the film-form substrate (3), and is detachably attached to the pressure head (13).

Description

technical field [0001] The present invention relates to a bonding device for pressure-bonding a film-shaped substrate on which a group of external connection terminals is formed on an edge portion, and a film-shaped substrate holding unit used in the bonding device. Background technique [0002] Conventionally, as a bonding device for crimping a film-like substrate having external connection terminal groups formed on the edge thereof, there is known a crimping head in which a crimping tool and a suction portion for holding the film-like substrate are integrally provided. . In this bonding device, the wire portion on which the external connection terminal group is formed is sucked by a crimping tool, and the portion extending from the edge portion is sucked by a plurality of suction portions to hold the film-like substrate. Since the plurality of adsorption portions are arranged at positions corresponding to the shape of the film-form substrate, even a film-form substrate ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/603H01L21/67
CPCH01L24/78H01L2224/78982
Inventor 龟田明浜田隆二山田真五味村好裕
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD