Profile redesigning method of automobile covering part die based on T spline

A technology for automotive cover and redesign, applied in computing, special data processing applications, instruments, etc., can solve the problem of CAD/CAE being unable to be seamlessly integrated, and achieve the effect of reducing the degree of freedom

Active Publication Date: 2014-11-19
CHONGQING INST OF GREEN & INTELLIGENT TECH CHINESE ACADEMY OF SCI
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Problems solved by technology

[0008] In view of this, the object of the present invention is to provide a method for redesigning the shape of an automobile panel mold based on T-sp

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  • Profile redesigning method of automobile covering part die based on T spline

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[0017] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0018] figure 1 It is a schematic flow chart of the method of the present invention. As shown in the figure, the method consists of 4 steps. Including: step 1), converting the digital model of the car panel (S0) into a single T-spline surface (S1) on any topology structure, this step includes two sub-steps of watertight stitching and character optimization; step 2), using etc. Geometric analysis method is used to obtain a single T-spline surface expressing the springback deformation amount (S2); step 3), and an isogeometric analysis method is used to obtain a single T-spline surface expressing springback compensation (S3); step 4) , convert S3 into a mold surface (S4) for automobile panels compatible with international standards.

[0019] S0 is the design input, S4 is the design output, S1 and S4 are sets of multiple clipped NURBS surface...

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Abstract

The invention relates to a profile redesigning method of an automobile covering part die based on a T spline and belongs to the technical field of automobile covering part die design. The profile redesigning method comprises the steps that firstly, an automobile covering part digital model S0 is transformed into a single sheet T spline surface S1 on any topological structure; secondly, a single sheet T spline surface S2 for expressing rebound deformation is obtained with an isogeometric analysis method; thirdly, a single sheet T spline surface S3 for expressing rebound compensation is obtained with the isogeometric analysis method; lastly, the S3 is transformed into an automobile covering part die profile S4 compatible with the international standard. According to the profile redesigning method of the automobile covering part die based on the T spline, the T spline serves as a carrier of the redesign of the profile of an automobile covering part die, isogeometric analysis serves as the means, and the design result can be used for parameterization of the design flow of the automobile covering part die. In addition, the isogeometric analysis method of rebound calculation and compensation based on a T spline primary function is adopted, and thus the degree of freedom of massive numerical calculation is greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of automobile panel mold design, and relates to a shape and surface redesign method of an automobile panel mold based on T-splines. Background technique [0002] At present, due to the huge difference between the digital models of design and analysis, it is difficult for the digital models to achieve true interoperability in the seamless integration of design and analysis. The so-called seamless integration of design and analysis is only one-way lossless data exchange between design software and analysis software, that is, one-way mapping from design to analysis. For digital models of free-form surface parts with extremely high geometric accuracy and extremely demanding physical performance requirements (such as digital models of automobile panels), the design evolution is affected by the inevitable fine gaps or overlaps inherent in cutting NURBS. The result is that the digitized model itself is not waterti...

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Application Information

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IPC IPC(8): G06F17/50
Inventor 范树迁石明全井光辉张鹏刘基权邹劲松
Owner CHONGQING INST OF GREEN & INTELLIGENT TECH CHINESE ACADEMY OF SCI
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