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Low-cost manufacturing method for drilled circuit board

A production method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of high cost and low efficiency, and achieve the effects of high production efficiency, time saving and cost saving.

Active Publication Date: 2014-11-19
AKM ELECTRONICS TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of low efficiency and high cost in mass production of drilled circuit boards in the prior art, the present invention discloses a method for manufacturing a low-cost drilled circuit board. Using this method, the efficiency of producing circuit boards is greatly improved, and at the same time, the production cost is reduced. Cost of production

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  • Low-cost manufacturing method for drilled circuit board
  • Low-cost manufacturing method for drilled circuit board

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Embodiment Construction

[0036] The dielectric plate mentioned in the present invention is the substrate (PI) made of dielectric material. The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0037] The production method described in the present invention breaks through the traditional production mode. The traditional circuit board production process is to first cover the surface of the dielectric board with copper foil, and then according to different needs, drill on the circuit board covered with copper foil. Holes and making graphic circuit layers and other processes. Because the surface of the circuit board covered with copper foil is relatively smooth, the friction between the plates is small, it is easy to slide and dislocate when stacked, and static electricity cannot be used to fix the multi-layer copper clad laminate, so the traditional drilling is to drill each circuit board one by one. hole. However, this production...

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Abstract

The invention relates to the field of circuit boards and discloses a low-cost manufacturing method for a drilled circuit board. The manufacturing method includes the following steps that S1, multiple dielectric boards equal in size are neatly stacked and fixed; S2, overall drilling is performed on the stacked and fixed dielectric boards at preset positions; S3, the dielectric boards are roughened; S4, the dielectric boards are metallized; S5, pattern circuit layers are manufactured on the surfaces of the dielectric boards. The method is used for producing the circuit board, so that the efficiency is substantially improved, and meanwhile the production cost is lowered.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for manufacturing a circuit board. Background technique [0002] Printed circuit boards have been widely used in various fields related to electronics, and the market demand is very large. However, the current development of the circuit board production industry is restricted by two factors: production efficiency and processing cost. The inability to improve production efficiency will limit the development scale of the entire industry, and the high processing cost will hinder the further promotion and application of circuit boards, lacking market competitiveness. It is difficult to improve production efficiency and reduce processing costs due to various reasons. One of the reasons is the restriction of efficiency and cost by the existing method of mass production of circuit boards. This restriction on efficiency and cost is prominently reflected in drilling low efficiency...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 崔成强
Owner AKM ELECTRONICS TECH SUZHOU