A kind of LED encapsulation structure and preparation method thereof

Abstract

The invention discloses an LED packaging structure and a manufacturing method thereof. The manufacturing method comprises the steps of (1) preparing an LED support which comprises a shell and metal pins connected to the shell, wherein a bowl-shaped inner cavity is formed in the shell; (2) fixing LED chips to the bottom of the bowl-shaped inner cavity; (3) binding the LED chips; (4) installing the LED support in an inner cavity of a heating and heat preserving die, and pressing the die to achieve sealing; (5) injecting epoxy molding compounds into the die through a glue injection hole of the die to enable the inside and outside of the bowl-shaped inner cavity of the shell to be filled with the epoxy molding compounds, and solidifying the epoxy molding compounds; (6) opening the die, taking out the LED support, processing the metal pins of the LED support to enable the metal pins to make contact with the epoxy molding compounds outside the shell, and obtaining the LED packaging structure. By the adoption of the LED packaging structure and the manufacturing method thereof, LED packaging structures with multiple shapes, structures and sizes can be produced conveniently and flexibly, electric leakage and lighting failures of the LED packaging structure obtained are avoided, and product consistency is high.

Description

[0001] 【Technical field】 [0002] The invention relates to light emitting diodes, in particular to an LED packaging structure and a preparation method thereof. [0003] 【Background technique】 [0004] The existing LED packaging structure is mainly SMD LED (SMD-LED). The packaging method of the SMD LED has a bracket potting type. The bracket potting type LED packaging structure includes a bracket, such as figure 1 As shown, it is a schematic structural diagram of the bracket, and the bracket includes a shell 100 and copper pins 200 . The shell 100 is made of PPA plastic, and is provided with a cavity of a plastic bowl, in which an LED chip is mounted by crystal bonding, and the LED package structure is obtained after curing with liquid epoxy resin. This kind of LED packaging structure is prone to fatal hidden dangers such as electric leakage and dead lights. In addition, the dispensing plane in the cavity of the bowl and cup will have "concave cup" and "convex cup" defects d...

AI Technical Summary

Problems solved by technology

This kind of LED packaging structure is prone to fatal hidden dangers such as electric leakage and dead lights.

In addition, the dispensing plane in the cavity of the bowl and cup will have "concave cup" and "convex cup" defects due to the amount of glue, and the product's luminous angle and brightness will be affected, making it impossible to achieve consistency

Moreover, when this kind of LED packaging structure is prepared, it is formed by dispensing and curing, so that the structure and shape of the product are relatively fixed and single, and it cannot be flexibly applied to various application situations.

Moreover, when preparing LED packaging structures in the prior art, if you want to prepare LED packaging structures of various sizes, you can only prepare brackets of various sizes, and the development cost of the brackets is particularly high, resulting in the production of LED packaging structures of various sizes. high production cost

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